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Copper surface passivation composition, application thereof, and photoresist stripping liquid containing copper surface passivation composition

A technology of copper surface and composition, applied in the application field of microelectronics technology, can solve problems such as poor electrical performance of finished products, roughened metal wiring, and decreased product yield, achieving no residual pollutants, good environmental protection, and reduced pollution Effect

Active Publication Date: 2022-01-11
ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] As mentioned above, metal copper is widely used in the front and rear ends of the manufacture of microelectronic devices, and it is inevitable to contact chemical solutions (such as CMP, cleaning fluid, etc.) Causes corrosion of copper, which in turn leads to a decline in product yield
In addition, after CMP treatment, there are many kinds of residues left on the semiconductor substrate. These residues can cause damage or severe corrosion to the copper wires, resulting in severe roughening of the metal wiring, and ultimately lead to poor electrical properties of the finished product.

Method used

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  • Copper surface passivation composition, application thereof, and photoresist stripping liquid containing copper surface passivation composition
  • Copper surface passivation composition, application thereof, and photoresist stripping liquid containing copper surface passivation composition
  • Copper surface passivation composition, application thereof, and photoresist stripping liquid containing copper surface passivation composition

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] Embodiment 1: Preparation of photoresist stripping solution

[0081] Step 1: Weigh the following components by mass respectively: 0.5 parts of copper surface passivation composition (4-(2-pyridylazo) resorcinol and N-acetyl-D - a mixture of glucosamine), 75 parts of water-soluble organic solvent diethylene glycol monoethyl ether, 21 parts of base N-ethylethanolamine, 17.5 parts of polyol 1,3-propylene glycol and 5.5 parts of deionized water;

[0082] Step 2: Add the copper surface passivation composition, water-soluble organic solvent, alkali and polyhydric alcohol into deionized water at room temperature, and fully stir and mix evenly to obtain a uniform and transparent photoresist stripping solution. Name it G1.

Embodiment 2

[0083] Embodiment 2: Preparation of photoresist stripping solution

[0084] Step 1: Weigh the following components by mass respectively: 1 part of copper surface passivation composition (4-(2-pyridylazo) resorcinol and N-acetyl-D - a mixture of glucosamine), 60 parts of water-soluble organic solvent dimethylsulfoxide, 40 parts of base benzyltrimethylammonium hydroxide, 5 parts of polyol diethylene glycol and 10 parts of deionized water;

[0085] Step 2: Add water-soluble organic solvent, alkali and polyol to deionized water at room temperature to obtain a mixed solution, then add the copper surface passivation composition to the mixed solution under stirring, and fully stir and mix evenly , to obtain a uniform and transparent photoresist stripping solution, which is named G2.

Embodiment 3

[0086] Embodiment 3: Preparation of photoresist stripping solution

[0087] Step 1: Weigh the following components by mass respectively: 0.01 part of copper surface passivation composition (4-(2-pyridylazo) resorcinol and N-acetyl-D - a mixture of glucosamine), 90 parts of water-soluble organic solvent sulfolane, 2 parts of alkali tetramethylammonium hydroxide, 30 parts of polyol ethylene glycol and 1 part of deionized water;

[0088] Step 2: Add the copper surface passivation composition, water-soluble organic solvent, alkali and polyhydric alcohol into deionized water at room temperature, and fully stir and mix evenly to obtain a uniform and transparent photoresist stripping solution. Named G3.

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PUM

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Abstract

The invention relates to a copper surface passivation composition. The copper surface passivation composition comprises 4-(2-pyridylazo)resorcinol and a glucosamine derivative. The invention also relates to a photoresist stripping liquid containing the copper surface passivation composition, and a cleaning method of a copper substrate. The copper surface passivation composition has good copper passivation protection performance, so the composition can be used for photoresist removal and copper surface passivation protection in a bump process of semiconductor back-end packaging, and has good industrial application prospects and popularization potential in the technical field of microelectronics.

Description

technical field [0001] The present invention relates to a compound composition used in the semiconductor preparation process and its use, in particular to a copper surface passivation composition used to passivate copper surfaces, its use and photoresist stripping comprising the composition Liquid belongs to the application field of microelectronic technology. Background technique [0002] Metal copper (Cu) has a very wide application in the semiconductor field, for example, it is used in the manufacturing process of the semiconductor front-end and the packaging process of the back-end. In the front-end process of IC manufacturing, as the process continues to advance, the feature size continues to decrease. The traditional Al / SiO 2 The interconnection line system has been unable to meet the technical requirements. In order to reduce the interconnection RC delay, in 1997, IBM first adopted the dual damascene process of Cu wire interconnection. From below the 0.13μm process...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027C23C22/02C23C22/63C23G1/20C23G5/02
CPCC23C22/02C23C22/63C23G1/20C23G5/02H01L21/0274Y02P70/50
Inventor 侯军申海艳
Owner ZHEJIANG AUFIRST MATERIAL TECH CO LTD
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