Groove PiN type beta irradiation battery with passivation layer surface field and preparation method of groove PiN type beta irradiation battery
A passivation layer and surface field technology, applied in the field of microelectronics, can solve the problems of increasing the saturation current of PiN devices, enhancing the negative effects of surface recombination, and limiting energy conversion efficiency, so as to reduce saturation current, improve Isc, and improve energy conversion. The effect of efficiency
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Embodiment 1
[0043] See figure 2 , figure 2 A schematic structural diagram of a grooved PiN type β-irradiated cell with a passivation layer surface field provided by an embodiment of the present invention. The irradiation battery includes: a PiN unit and a radioisotope unit located on the PiN unit.
[0044] PiN unit includes N-type doped 4H-SiC substrate 1, N-type doped 4H-SiC epitaxial layer 2, P-type doped 4H-SiC epitaxial layer 3, N-type ohmic contact electrode 4, isolation passivation layer 5, trench Groove passivation layer 6 , P-type ohmic contact electrodes 7 and several groove regions 9 .
[0045] Specifically, the shape of the PiN unit includes but not limited to square or circle. When the PiN unit is square, its mesa area is 0.5×0.5cm~1.0×1.0cm; when the PiN unit is circular, its mesa area is Φ0.5cm~Φ1.0cm; the area of PiN unit is not limited to the above-mentioned area size.
[0046] The N-type ohmic contact electrode 4, the N-type doped 4H-SiC substrate 1, the N-type d...
Embodiment 2
[0065] On the basis of Example 1, please refer to Figure 5a-Figure 5l , Figure 5a-Figure 5l It is a process schematic diagram of a method for preparing a grooved PiN type β-irradiated cell with a surface field of a passivation layer provided by an embodiment of the present invention. The preparation method comprises steps:
[0066] S1. Epitaxial growth of N-type doped 4H-SiC epitaxial layer 2 on N-type doped 4H-SiC substrate 1, see Figure 5a and Figure 5b .
[0067] First, the N-type doped 4H-SiC substrate 1 sample is cleaned to remove surface pollutants.
[0068] Then, use chemical vapor deposition CVD to epitaxially grow a layer with a doping concentration of 1×10 on the cleaned N-type highly doped 4H-SiC substrate 1 sample surface. 14 ~1×10 15 cm -3 N-type low-doped 4H-SiC with a thickness of 4.0-10.0 μm forms an N-type doped 4H-SiC epitaxial layer 2 .
[0069] S2. Epitaxial growth of P-type doped 4H-SiC epitaxial layer 3 on N-type doped 4H-SiC epitaxial layer 2, ...
Embodiment 3
[0090] On the basis of Example 2, please combine Figure 5a-Figure 5l , this embodiment takes the preparation of a grooved silicon carbide PiN type β-irradiated cell with a grid-shaped distributed P-type region and a passivation layer surface field as an example to describe its preparation method in detail, wherein the cell area is 0.6×0.6 cm , the groove width is 400 μm, the number of electrodes in the longitudinal rectangular strip 72 is 14, and the number of electrodes in the horizontal rectangular strip 73 is 1.
[0091] S1. Epitaxial growth of an N-type doped 4H-SiC epitaxial layer 2 on an N-type doped 4H-SiC substrate 1 .
[0092] First, use standard RAC to clean the N-type doped 4H-SiC substrate 1 sample to remove surface pollutants, see Figure 5a .
[0093] Specifically, first at 25°C, the doping concentration is 5×10 18 cm -3 , a sample of N-type highly doped 4H-SiC substrate with a thickness of 380 μm was placed in H 2 SO 4 :H 2 o 2 Soak in the reagent of (4...
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