Silicon or sulfur-containing film-forming resin and photoresist composition
A technology of film-forming resin and photoresist, which is applied in the field of film-forming resin and photoresist composition, can solve the problems of high brittleness of film-forming resin, poor resolution of photoresist, and poor adhesion of substrate materials, etc., and achieve good The effect of toughness, high resolution and good adhesion
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Embodiment 1
[0038] This embodiment is a sulfur-containing film-forming resin, and the comonomers of the film-forming resin in this embodiment are compound (I) and compound (II), and the polymerization reaction equation is as follows:
[0039]
[0040] The polymerization reaction process was as follows: 8.76g of compound (I), 11.24g of compound (II), 0.40g of free radical initiator azodiisocyanate (AIBN) and 200mL of solvent methyl isobutyl ketone were added into a 500mL three-necked flask. Under nitrogen protection, the reaction temperature was controlled at 75-80° C., and the reaction was stirred for 10 h. After the reaction was completed and the reaction liquid was cooled to 25°C, the product was extracted with methanol, and repeated three times, and the product was dried in an oven for 20 hours to obtain compound (I)-compound (II) binary copolymer film-forming resin, which was designated as film-forming resin 1 .
[0041] GPC (gel permeation chromatography) was used to test the pro...
Embodiment 2
[0044] This embodiment is a sulfur-containing film-forming resin. The raw materials, polymerization reaction equation and polymerization reaction process used are the same as in Example 1, except that the amount of raw materials is 4.84g compound (I), 15.16g compound (II), 0.35g g AIBN, the film-forming resin obtained by polymerization is recorded as film-forming resin 2.
[0045] GPC (gel permeation chromatography) was used to test the product, and the weight average molecular weight of the obtained film-forming resin 2 was 7400 g / mol, and the molecular weight distribution was 2.48.
Embodiment 3
[0047] This embodiment is a sulfur-containing film-forming resin. The raw materials, polymerization reaction equation and polymerization reaction process used are the same as in Example 1, except that the amount of raw materials is 6.37g of compound (I), 13.63g of compound (II), 0.45 gAIBN, the film-forming resin obtained by polymerization is recorded as film-forming resin 3.
[0048] The product was tested by GPC (Gel Permeation Chromatography), and the weight average molecular weight of the obtained film-forming resin 3 was 4300 g / mol, and the molecular weight distribution was 2.11.
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