Closed-loop pulsating heat transfer pipe and heat dissipation heat exchanger

Abstract

The invention discloses a closed-loop pulsating heat transfer pipe and a heat dissipation heat exchanger. The heat transfer pipe comprises a pipe body which is continuously bent, the two ends of the pipe body are connected through a liquid filling pipe to form a closed-loop structure, pipe holes are formed in the pipe body in an array mode, the pipe holes are vacuumized and filled with a heat conduction working medium, and the heat conduction working medium continuously reciprocates in a closed-loop pipeline formed by the pipe body. The heat transfer pipe is simple in technological process, low in technological requirement, low in investment, convenient to machine and low in equipment, technology, material cost and the like, the super-effect heat transfer and heat dissipation function can be achieved, thermal control management of various high heat flux is achieved with low cost, the application range is wide, and thermal control application of some special environment equipment is achieved.

Description

technical field [0001] The invention relates to the field of heat control, heat dissipation, heat exchange technology and devices, in particular to a closed-loop pulsating heat transfer tube, a radiator, a heat exchanger, and a heat control system. Background technique [0002] At present, thermal control management is required in electronics, electrical appliances, communications, computer products, automobiles, new energy and various equipment with high heat flux density. The original radiator has many materials and shapes, and most of them are made of copper and aluminum. , complex structure, large volume, heavy weight, relatively slow heat conduction speed, and the overall temperature of the radiator is inconsistent, the temperature difference of each part of the radiator is large, the heat sink of the heat source chip is super high, etc.; on the other hand, with the height of various electronic chips and circuits With the continuous development trend of integration, new...

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Problems solved by technology

[0002] At present, thermal control management is required in electronics, electrical appliances, communications, computer products, automobiles, new energy and various equipment with high heat flux density. The original radiator has many materials and shapes, and most of them are made of copper and aluminum. , complex structure, large volume, heavy weight, relatively slow heat conduction speed, and the overall temperature of the radiator is inconsistent, the temperature difference of each part of the radiator is large, the heat sink of the heat source chip is super high, etc.; on the other hand, with the height of various electronic chips and circuits With the continuous development trend of integration, new materials, and new energy battery products, the original heat transfer and heat dissipation solutions for heat conduction and heat dissipation materials have been difficult to solve the thermal control management needs of electronic chips with high heat flux density, highly integrated circuits, new materials, and new energy products. Unable to quickly transfer and dissipate the heat continuously generated by the heat source body, resulting in super high temperature of heat sinks such as heat source chips, electronic circuits, and new energy products. The heat source chip continues to work, and the temperature continues to rise, seriously affecting and damaging products. The use effect and service life

In order to solve the thermal control management of integrated chips and power modules with high heat flux density, people continue to invent various thermal control and heat dissipation solutions based on the phase change principle of heat pipes. ) heat dissipation thermal control has been widely used, but for example, the processing process of conventional copper sintered heat pipes is complicated, the process precision is very high, there are many application equipment, and the production capacity can only be formed with a large investment. The cost of equipment, materials and processes is very high. Commonly used Copper sintered core heat pipes, gravity groove heat pipes, etc. have complex structures when combined with heat dissipation devices. These various reasons cause the overall cost of these heat pipe cooling solutions to be very high, and in some application environments --- such as aviation, aerospace, satellites, etc. Not suitable for applications in deep space vacuum environments

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