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Polyamic acid solution as well as preparation method and application thereof

A polyamic acid and solution technology, which is applied in the production of bulk chemicals and other directions, can solve the problems such as failure to achieve, and achieve the effect of increasing molecular weight and increasing glass transition temperature.

Pending Publication Date: 2022-03-01
JILIN OPTICAL & ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Patent 201811209047.3 puts diamine monomer and dianhydride monomer in ionic liquid for reaction. After the reaction, the mixture is precipitated with deionized water to obtain polyimide powder, and then the polyimide powder is dissolved in the aprotic electrode Films are formed on substrates in non-toxic solvents; although the thermal expansion coefficient of the polyimide film has been improved, it still does not reach below 10ppm / °C

Method used

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  • Polyamic acid solution as well as preparation method and application thereof
  • Polyamic acid solution as well as preparation method and application thereof
  • Polyamic acid solution as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] (1) Under the protection of nitrogen, 10.8140g (0.1mol) PDA, 0.0101g 1-ethyl-3-methylimidazolium ammonium dicyanide, 0.8730g (0.004mol) di-tert-butyl dicarbonate and 111.3920g NMP Put it into a reactor equipped with a stirring paddle and a thermometer, the rotation speed is 300 rpm, and react at 50° C. for 2 hours. 2.1812g (0.01mol) PMDA, 26.4798g (0.09mol) BPDA and 50.0000g NMP were added, and the experiment was ended after 12 hours of reaction to obtain a polyamic acid solution with a solid content of 20%.

[0063] (2) Take the polyamic acid solution prepared above and use a filter to filter, the filter membrane size is 5 μm, degas the filtered solution under reduced pressure, take 20mL of the treated solution and place it on an 8-inch silicon crystal plate, Use a spin coater to coat the film with a rotation speed of 700rpm and a duration of 30s. After the coating is completed, move the silicon crystal plate to a heating plate at 120°C for drying for 15 minutes. After...

Embodiment 2

[0065] (1) Under the protection of nitrogen, 10.8140g (0.1mol) PDA, 0.0638g 1-ethyl-3-methylimidazolium ammonium dicyanide, 0.8730g (0.004mol) di-tert-butyl dicarbonate and 111.3920g NMP Put it into a reactor equipped with a stirring paddle and a thermometer, the rotation speed is 300 rpm, and react at 50° C. for 2 hours. 2.1812g (0.01mol) PMDA, 26.4798g (0.09mol) BPDA and 50.0000g NMP were added, and the experiment was ended after 12 hours of reaction to obtain a polyamic acid solution with a solid content of 20%.

[0066] (2) The post-treatment and film-forming process of the polyamic acid solution are the same as in Example 1.

Embodiment 3

[0068] (1) Under the protection of nitrogen, 10.8140g (0.1mol) PDA, 0.1210g 1-ethyl-3-methylimidazolium ammonium dicyanide, 0.8730g (0.004mol) di-tert-butyl dicarbonate and 111.3920g NMP Put it into a reactor equipped with a stirring paddle and a thermometer, the rotation speed is 300 rpm, and react at 50° C. for 2 hours. 2.1812g (0.01mol) PMDA, 26.4798g (0.09mol) BPDA and 50.0000g NMP were added, and the experiment was ended after 12 hours of reaction to obtain a polyamic acid solution with a solid content of 20%.

[0069] (2) The post-treatment and film-forming process of the polyamic acid solution are the same as in Example 1.

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Abstract

The invention relates to a polyamic acid solution and a preparation method and application thereof, and belongs to the technical field of high polymer materials, the polyamic acid solution comprises polyamic acid, an aprotic polar solvent and an ionic liquid, and the boiling point of the ionic liquid is greater than 350 DEG C; the polyamide acid comprises a compound with the following structural formula: in the formula, X is a tetravalent tetracarboxylic dianhydride residue of an aliphatic ring group or an aromatic ring group with 4-30 carbon atoms; y is a divalent diamine residue of an aliphatic ring group or an aromatic ring group with a carbon atom number of 4-30; and n is an integer from 10 to 600. The ionic liquid is introduced into the polyamide acid solution, and when polyimide is prepared, strong interaction force exists between the ionic liquid and polyimide molecules, so that polyimide molecular chains are separated, mutual entanglement among the molecular chains is reduced, chain segments tend to be arranged in order, and the polyimide is prepared. The thermal decomposition temperature of the polyimide film is increased, and the thermal expansion coefficient is reduced.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a polyamic acid solution and its preparation method and application. Background technique [0002] In recent years, with the rapid development of electronic information technology, people's requirements for electronic equipment and display devices have become higher and higher. Flexible displays have attracted widespread attention because of their characteristics of lightness, thinness, rollability, and various shapes. Since polyimide contains aromatic rings and imide rings in its molecular chain, it has excellent heat resistance, dimensional stability and mechanical properties, and can be used as a substrate in electronic image display devices. [0003] However, during the manufacturing process of the display, the deposition and processing of materials such as low-temperature polysilicon require extremely high temperatures, which requires the substrate of the display t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1067C08G73/1071C08G73/1032C08G73/1028C08J5/18C08J2379/08Y02P20/54
Inventor 马晓宇赵贺张求学杨天宇吕庆龙
Owner JILIN OPTICAL & ELECTRONICS MATERIALS
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