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High-thixotropy and high-dispersion resin, silver paste, preparation method and application

A high-dispersion, high-thixotropic technology, applied to conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, electrical components, etc. Achieve the effect of solving negative effects, good dispersion wetting and thickening thixotropy

Pending Publication Date: 2022-04-05
GUANGDONG NANHAI ETETB TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This low-viscosity state leads to serious problems such as sag, flow, and thin edges, especially thin edges will seriously affect the insertion loss performance of the filter

Method used

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  • High-thixotropy and high-dispersion resin, silver paste, preparation method and application
  • High-thixotropy and high-dispersion resin, silver paste, preparation method and application
  • High-thixotropy and high-dispersion resin, silver paste, preparation method and application

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preparation example Construction

[0101] A preparation method of highly thixotropic and highly dispersed resin, comprising the following steps:

[0102] S1: Dissolving the main chain resin containing the first active group in a solvent and heating;

[0103] S2: Add at least two side-chain resins with second active groups at the end groups and keep warm for reaction; the second active groups at one end of the side-chain resins react with the first active groups, and the side-chain resins are grafted to the main chain Resin; the side chain resin includes the following segments as:

[0104]

[0105] -m-include-OR 1 -, -R 1 OR 2 -, -CO-, -R 1 At least one of CO-, -COO-, -NHCOO-, or a combination of two or more, or a derivative structure of -M-; n is the degree of polymerization; R 1 and R 2 is an alkyl group;

[0106] S3: Add the hyperbranched polymer with the third active group at the end, and keep warm for reaction; the third active group reacts with the second active group, and the hyperbranched polym...

Embodiment A

[0144] 1) Dissolve ethyl cellulose containing aliphatic hydroxyl groups in diethylene glycol butyl ether acetate, terpineol, and Solvesso200, and heat to 100°C;

[0145] 2) The selected grafted side chain has the following structure: both ends contain epoxy groups, and the middle segment is selected n=200. The amount of grafted side chains used is put into 1:10 according to the molar ratio; in the solution obtained in the above step 1), add the grafted side chains in proportion, and keep it at 100°C for 24 hours;

[0146] 3) Add the hyperbranched polymer according to the same amount of substance as the grafted side chain, and its end segment contains -COOH group, and the middle branch arm is selected n=50; keep at 100°C after adding, and react for 15 hours to obtain a highly thixotropic and highly dispersed resin.

[0147] After obtaining the modified resin, the silver paste can be prepared according to the following process:

[0148] 1) Dissolve it in diethylene glycol b...

Embodiment B

[0163] 1) Dissolve polyvinyl acetal resin containing aliphatic hydroxyl groups in terpineol, diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, and heat to 100°C; the polyvinyl acetal resin is composed of chain 1 Prepared by random copolymerization with chain 2;

[0164] Chain 1 includes: Chain 2 includes: R for -C 3 h 7 , part Y is hydroxyl, part Y is -OOCCH 3 .

[0165] 2) The selected grafted side chain has the following structure: both ends contain epoxy groups, and the middle segment is selected The combination of n=50. The amount of grafted side chains to be used is respectively put into 1:8 according to the molar ratio; in the solution obtained in the above step 1), the grafted side chains are added in proportion, and kept at 100°C, and reacted for 10 hours;

[0166] 3) Add the hyperbranched polymer according to the same amount of substance as the grafted side chain, the end segment contains -OH, and the middle branch arm is selected...

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Abstract

The invention discloses high-thixotropy and high-dispersion resin, silver paste, a preparation method and application, a main chain of the resin is connected with a plurality of side chains, and the tail segments of the side chains are provided with hyperbranched structures; the silver paste uses the resin with high thixotropy and high dispersion. The preparation method is used for preparing the resin and the silver paste. According to the high-thixotropic and high-dispersion resin provided by the scheme, the tail segment of the side chain grafted on the main chain of the resin has a hyperbranched structure, and a molecular structure with telechelics is formed, so that the resin has dual functions of a thixotropic agent and a dispersing agent. The modified resin used in the silver paste in the scheme has the effects of dispersing wetting and thickening thixotropic, the problem of mutual interference caused by an additional dispersing wetting agent and an additional thickening thixotropic agent cannot be generated, and the negative effect caused by direct addition of an auxiliary for improving thixotropic property is effectively solved.

Description

technical field [0001] The invention relates to the technical field of silver paste resin, in particular to a highly thixotropic and highly dispersed resin, silver paste, a preparation method and application. Background technique [0002] High-temperature silver paste is mainly composed of easily decomposed resin, silver powder, glass powder, solvent and various additives. It is widely used in photovoltaics, filters, inductors, resistors, capacitors and other fields. Usually, the part composed of resin, solvent and additives is called an organic carrier, which mainly endows the silver paste with various construction properties, such as meeting the technical requirements of silk screen printing, pad printing, spray coating, dip coating, etc. The resin used needs to be easily decomposed by heat (oxygen) and has less carbon residue. The silver powder provides electrical conductivity, while the glass powder provides bonding properties and at the same time assists in the sinteri...

Claims

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Application Information

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IPC IPC(8): C08G83/00H01B1/22H01B13/00
Inventor 周虎周炳明胡永能曾湘涛黄良辉
Owner GUANGDONG NANHAI ETETB TECH CO LTD
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