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Photosensitive slurry for fused quartz photocuring molding and preparation method and curing molding method thereof

A light-curing molding, fused silica technology, applied in glass molding, glass manufacturing equipment, manufacturing tools, etc., can solve problems such as poor light transmittance and low density, and achieve low technical cost, high contrast, and molding accuracy. high effect

Pending Publication Date: 2022-04-15
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problems of low product density and poor light transmittance in the 3D printing molding process of glass, and provide a photosensitive paste for fused silica photocuring molding and its preparation method and application

Method used

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  • Photosensitive slurry for fused quartz photocuring molding and preparation method and curing molding method thereof
  • Photosensitive slurry for fused quartz photocuring molding and preparation method and curing molding method thereof
  • Photosensitive slurry for fused quartz photocuring molding and preparation method and curing molding method thereof

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specific Embodiment approach 1

[0037] Specific Embodiment 1: In this embodiment, the photosensitive slurry used for fused silica photocuring molding includes according to parts by weight:

[0038]

[0039] Wherein said monofunctional diluent is hydroxyethyl acrylate, hydroxypropyl acrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate or 4-hydroxybutyl acrylate;

[0040] Described polyfunctional diluent is diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol (200) diacrylate, polyethylene glycol (400 ) diacrylate, polyethylene glycol (600) diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, Neopentyl glycol diacrylate, tetraethylene glycol diacrylate, trimethylolpropane triacrylate or ethoxylated trimethylolpropane triacrylate.

[0041] SiO described in this embodiment 2 The characteristics of the powder are: the particle size is 5-500nm, and the specific su...

specific Embodiment approach 2

[0043] Specific embodiment two: The difference between this embodiment and specific embodiment one is that the photoinitiator is selected from photoinitiator 369, photoinitiator 651, photoinitiator 784, photoinitiator 819, photoinitiator 907, photoinitiator Agent DETX, photoinitiator CTX or photoinitiator TPO.

specific Embodiment approach 3

[0044] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that the polymerization inhibitor is hydroquinone, hydroxyanisole or 2,6 di-tert-butyl-p-cresol.

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Abstract

The invention discloses photosensitive slurry for fused quartz photocuring molding and a preparation method and a curing molding method thereof, and aims to solve the problems of low density and poor light transmittance of a product in a 3D printing molding process of glass. The photosensitive slurry for fused quartz photocuring molding is prepared from the following components in parts by weight: 400 to 800 parts of monofunctional diluent, 200 to 600 parts of polyfunctional diluent, 0 to 300 parts of phenoxyethanol, 700 to 1500 parts of SiO2 powder, 1 to 10 parts of photoinitiator, 1 to 10 parts of polymerization inhibitor and 1 to 10 parts of dye. Nanometer SiO2 powder is added into photosensitive resin, forming of the SiO2-resin composite material is achieved through the photocuring forming technology, then the resin component is removed through the heat treatment technology, and finally sintering forming of pure SiO2 fused quartz is achieved. Rapid forming and manufacturing of fused quartz with complex structures can be effectively achieved, the forming precision is high, and the process is simple.

Description

technical field [0001] The invention belongs to the technical field of photocuring molding of materials, and in particular relates to a photosensitive slurry for photocuring molding of fused silica, a preparation method and application thereof. Background technique [0002] Fused silica glass is one of the most important materials in advanced engineering applications. It has excellent properties such as high light transmittance, good heat resistance, good chemical corrosion resistance, low thermal expansion coefficient, and high hardness. It is used in aerospace, chemical industry, metallurgy, etc. , optics, medicine and other fields have a wide range of applications. However, the processing and forming of glass is difficult and costly, which hinders the application of glass, especially the processing and forming technology of glass with complex configurations has always been a difficult problem in the world. According to the size of the characteristic structure, the existi...

Claims

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Application Information

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IPC IPC(8): C03C3/06C03B19/06C03B20/00C08F220/20C08F222/20C08F222/14
Inventor 赵瑜彭亚洲费维栋赵文悦王召
Owner HARBIN INST OF TECH