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Water-soluble photosensitive ink as well as preparation method and construction method thereof

A photosensitive ink and water-soluble technology, applied in the field of water-soluble photosensitive ink and its preparation, can solve the problems of short circuit, hidden danger of solvent or ink fire safety, easy to disperse and the like, achieve simple preparation steps, reduce sedimentation and layering phenomenon, Good castability and adhesion

Active Publication Date: 2022-04-15
LANBANG ELECTRONICS HARDWARE MATERIAL DONGGUAN
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, solvent-based photosensitive inks will produce a large amount of VOC emissions, which will pollute the environment, and the volatile gases in the production workshop will affect human health. In addition, the solvent components are flammable and explosive, which makes the solvents or inks have certain risks during storage and processing. fire safety hazard
[0004] At present, for the pollution of solvent-based photosensitive inks, water-based inks have been proposed, but the inventors believe that additives such as fillers are easily dispersed unevenly in the water system, and problems such as ink delamination occur, which is not conducive to the coating flow on the board. Ductility, and not firmly attached to the board, resulting in open circuit, short circuit, etc. in the printed circuit, with a high defect rate

Method used

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  • Water-soluble photosensitive ink as well as preparation method and construction method thereof
  • Water-soluble photosensitive ink as well as preparation method and construction method thereof
  • Water-soluble photosensitive ink as well as preparation method and construction method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0057] A kind of aqueous photosensitive resin, its preparation comprises the steps:

[0058] Mix 10kg of water and 16kg of co-solvent evenly, then add 40kg of acrylic resin, mix and stir to dissolve, and use an alkali neutralizer to adjust the pH value to 8 to obtain an acrylic resin solution;

[0059] Add 0.1 kg of polymerization inhibitor, 3.9 kg of catalyst and 30 kg of glycidyl methacrylate to the acrylic resin solution in sequence, and react for 15 hours while keeping the temperature at 80° C. to obtain a water-sensitive photosensitive resin.

preparation example 2-3

[0061] The difference between Preparation Example 2-3 and Preparation Example 1 lies in the differences in the amount, type and process parameters of raw materials, see Table 1 below for details.

[0062] The raw material of table 1 preparation example 1-3 and process condition comparison table

[0063]

[0064]

preparation example 4

[0066] The difference between this preparation example and the above-mentioned preparation example 2 is: first add glycidyl methacrylate to water and a cosolvent to disperse, add a polymerization inhibitor and a catalyst, and then add an acrylic resin. The specific steps are as follows:

[0067] Mix 15kg of water and 12.7kg of co-solvent evenly, then add 20kg of glycidyl methacrylate, mix and stir; then add 0.3kg of polymerization inhibitor, 2kg of catalyst and 50kg of acrylic resin in sequence, and keep the temperature at 85°C for 13 hours , to prepare water-sensitive photoresin.

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Abstract

The invention relates to the field of ink, in particular to water-soluble photosensitive ink as well as a preparation method and a construction method thereof. The water-soluble photosensitive ink comprises the following raw materials in percentage by weight: 40-70% of water-based photosensitive resin, 3-6% of a photosensitizer, 4-15% of a photosensitive monomer, 0.3-3% of color-changing light powder, 10-40% of water and the balance of an auxiliary agent, the water-based photosensitive resin is mainly generated by reaction of acrylic resin and glycidyl methacrylate. The water-based photosensitive resin generated by the reaction of the acrylic resin and the glycidyl methacrylate enables the raw material components in the ink to be uniformly dispersed, the phenomena of ink layering and the like are not easy to generate, the flow ductility and the adhesiveness of the ink on a PCB (Printed Circuit Board) are better, and a polymer film formed by ultraviolet irradiation is good in adhesiveness and has a stable protection effect on a copper layer; a copper line formed after developing, etching and deinking is free of sand holes, open circuits, short circuits and other undesirable phenomena.

Description

technical field [0001] The application relates to the field of ink, more specifically, it relates to a water-soluble photosensitive ink and its preparation method and construction method. Background technique [0002] Printed circuit board (PCB) is the provider of electrical connection of electronic components. In the circuit production of PCB, a photosensitive film is often used to laminate the surface of the board, and the circuit is obtained after exposure, development, and etching. [0003] At present, most of the photosensitive films on the market are formed by solvent-based photosensitive inks after coating. The solvent components are used to promote the dispersion of various additives such as fillers in the inks, and promote the stable adhesion of inks on the substrate and rapid formation after coating. membrane. However, solvent-based photosensitive inks will produce a large amount of VOC emissions, which will pollute the environment, and the volatile gases in the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/107C09D11/03C09D11/033
Inventor 曲永钢刘洋
Owner LANBANG ELECTRONICS HARDWARE MATERIAL DONGGUAN
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