Nano-modified anti-leakage non-fire repair elastic material
A technology for nano-modification and repairing materials, which is applied in the direction of epoxy resin glue, adhesive type, polyurea/polyurethane adhesive, etc., and can solve the problem of data and related research without performance, lack of repairing material formula, etc. Problems, to achieve the effects of good aging resistance and medium corrosion resistance, strong adhesion, and good construction
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[0031] Preparation of modified nano-silica: 1 g of coupling agent KH550 was added to 200 ml of ethanol and 200 g of nano SiO was weighed 2 After washing with ethanol, added to the ethanol solution of the coupling agent, sonicated for 30min and then heated up to 60 °C for 30min, cooled and filtered, and the filter cake was washed with an appropriate amount of ethanol and dried for use.
[0032] Preparation of modified nano-alumina: 1 g of coupling agent KH570 was added to 200 ml of acetone, weighing 200 g of nanoAl 2 O 3 After washing with acetone, added to the acetone solution of the coupling agent, sonicated for 30min and then heated up to 60 °C for 30min, cooled and filtered, and the filter cake was washed with an appropriate amount of ethanol and dried for use.
[0033] Preparation of nano-silica modified epoxy resin: BPA epoxy resin E-51 was heated to 80 degrees, and 5% bisphenol A epoxy resin E-51 quality modified nano SiO was added 2 Stir for 30min, sonically disperse at 80 ...
Example Embodiment
[0046] Example 1:
[0047] Components A by mass fraction comprise: 15% nano-silica modified epoxy resin, 15% nano-alumina modified epoxy resin, 20% polyurethane-modified epoxy resin (SL3422), 10% polyetherimide CRS5001, 22.6% barium sulfate powder, 15% glycol diglyceride, 2% triethanolamine, 0.2% MT-900 polyamide wax, 0.2% MT-201 silicone defoamer;
[0048] B component by mass consists of: 10% diaminodiphenylmethane (DDM), 10% diethyl toluenediamine (DETDA), 20% methylcyclohexanediamine (HTDA), 10% bis-N, N'-(methyl-butylmethylene) - diethylenetriamine (methyl isobutyl ketone, diethyltriamine-reacted ketone), 38.9% barium sulfate powder, 8% glycol diglycetal glycidyl ether, 3% 3-mercaptotriethoxysilane, 0.1% MT-201 silicone defoamer;
[0049] Components A and B are matched according to a mass ratio of 1:1.
[0050] The present embodiment provides a tensile elastic modulus of the repair material cured at room temperature for 7 days of 6.1Gpa, flexural strength of 55MPa, compressive...
Example Embodiment
[0051] Example 2:
[0052]Components A by mass fraction include: 10% nano-silica modified epoxy resin, 30% nano-alumina modified epoxy resin, 20% polyurethane-modified epoxy resin (Dow DER852), 5% polyetherimide CRS5001, 12.5% barium sulfate powder, 20% isocyanate triglyceride, 2% triethanolamine, 0.3% MT-900 polyamide wax, 0.2% MT-201 silicone defoamer; B components by mass fraction comprise: 15% 4,4'-methylenebis (2,6-diethylaniline), 10% diethyl toluenediamine (DETDA), 20% 4,4'-diaminodicyclohexylmethane, 10% bis-N, N'- (methyl-butylmethylene) - diethyltriamine (methylisobutyl ketone, diethyltriamine-reacted ketone), 33.9% barium sulfate powder, 8% isocyanate triglyceride, 3% 3-Mercaptopropyltriethoxysilane, 0.1% MT-201 silicone defoamer;
[0053] Components A and B are matched according to a mass ratio of 1:1.
[0054] The present embodiment provides a tensile elastic modulus of the repair material cured at room temperature for 7 days of 6.0Gpa, flexural strength 60MPa, compr...
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