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Active metal brazing ceramic substrate and manufacturing method thereof

A technology of active metal solder and ceramic substrate, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as etching difficulties and chemical pollution, save production costs, simplify processes, and avoid electrical performance degradation Effect

Pending Publication Date: 2022-04-19
井敏
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problem that the production process of active metal brazing ceramic substrates is easy to cause chemical pollution and difficult to etch in the prior art, the present invention provides an active metal brazing ceramic substrate and a production method thereof, which can improve the accuracy and line width of circuit patterns The lower limit of the line distance, and can ensure the electrical performance of the AMB substrate; the manufacturing process of the present invention omits the use of etching solution and active metal solder, not only avoids the problem of environmental pollution, but also greatly reduces the production cost

Method used

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  • Active metal brazing ceramic substrate and manufacturing method thereof
  • Active metal brazing ceramic substrate and manufacturing method thereof
  • Active metal brazing ceramic substrate and manufacturing method thereof

Examples

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Embodiment 1

[0043] combine Figure 5 As shown, this embodiment adopts the above-mentioned method for manufacturing an active metal brazing ceramic substrate. Specifically, this embodiment is used to make AlN-AMB, and the specific steps are as follows:

[0044] (1) The copper sheet with the specification of 134mm*374mm*0.50mm is processed by the combination of laser processing and mechanical processing to process the designed circuit pattern on the copper sheet by incomplete etching. Among them, the line spacing of the circuit pattern is 300μm, and the processing depth is 0.3mm;

[0045] (2) Print the active metal solder on the circuit pattern of the copper sheet by a screen printing machine, and place it at a temperature of 250°C for 20 minutes to dry and soften it; then place it at a temperature of 450°C for 30 minutes to pre-alloy the copper sheet, so that The active metal solder has a certain bonding force with the copper sheet;

[0046] (3) Place the cleaned AlN ceramic sheet with a...

Embodiment 2

[0050] combine Image 6 As shown, this embodiment adopts the above-mentioned method for manufacturing an active metal brazing ceramic substrate, specifically, this embodiment is used to make Si 3 N 4 -AMB, the specific steps are as follows:

[0051] (1) Process the designed circuit pattern on both sides of the copper surface by incomplete etching on the copper sheet with the specification of 224mm*110mm*0.80mm by double-sided chemical etching method. The line spacing of the circuit pattern is 400μm, the residual copper is located in the middle of the copper sheet, and the etching depth of the circuit pattern on both sides of the copper sheet is 0.30mm;

[0052] (2) Print the active metal solder on the circuit pattern of the copper sheet by a screen printing machine, and place it at a temperature of 270°C for 25 minutes to dry and soften it; then place it at a temperature of 650°C for 30 minutes to pre-alloy the copper sheet, so that The active metal solder has a certain bon...

Embodiment 3

[0058] combine Figure 7 As shown, the present embodiment adopts the above-mentioned method for manufacturing an active metal brazing ceramic substrate. Specifically, this embodiment is used to make ZTA-AMB, and the specific steps are as follows:

[0059] (1) Process the designed circuit pattern on the copper surface by incomplete etching by machining the copper sheet with the specification of 132mm*374mm*0.40mm. The line spacing and line width of the circuit pattern are both 300μm, the residual copper is located at the lower part of the copper sheet, and the etching depth of the circuit pattern of the copper sheet is 0.25mm;

[0060] (2) Print the active metal solder on the circuit pattern of the copper sheet by a screen printing machine, and place it at a temperature of 250°C for 20 minutes to dry and soften it; then place it at a temperature of 650°C for 30 minutes to pre-alloy the copper sheet, so that The active metal solder has a certain bonding force with the copper sh...

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Abstract

The invention discloses an active metal brazing ceramic substrate and a manufacturing method thereof, and belongs to the field of ceramic metallization treatment. The method comprises the following steps of: processing a circuit pattern on a metal sheet in an incomplete etching manner; integrally printing an active metal solder on the circuit pattern and drying the active metal solder; then carrying out surface treatment on the metal sheet; the cleaned ceramic chip is installed in a fixing groove of a metal sheet, and then the metal sheet is folded to obtain an assembly part; then the N assembly parts are stacked together and sintered, so that the metal sheets and the ceramic sheets are sintered together; wherein N is greater than or equal to 1; and then residual metal of the assembly part is removed to form the active metal brazing ceramic substrate. Aiming at the problems that chemical pollution is easily caused and etching is difficult in the manufacturing process of the AMB substrate in the prior art, the manufacturing process omits the use of etching liquid and active metal solder, thereby not only avoiding the problem of environmental pollution, but also greatly reducing the production cost.

Description

technical field [0001] The invention belongs to the technical field of ceramic metallization treatment, and more specifically relates to an active metal brazing ceramic substrate and a manufacturing method thereof. Background technique [0002] The active metal brazing process is to place the active metal powder and the metal solder that can form an alloy with it at a certain temperature between the ceramic substrate and the metal copper, and heat and melt in a vacuum or an inert atmosphere to realize the sealing of the metal copper and the ceramic substrate. a way. The copper-clad ceramic substrate made by this process has the characteristics of high metallization layer bonding strength, good air tightness, and excellent electrical and thermal conductivity, and has been widely used in the field of high-power modules. [0003] At present, the production method of active metal brazed ceramic substrate (AMB substrate) is generally as follows: the active metal solder is printe...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L23/498
CPCH01L21/4846H01L23/49811H01L23/49838
Inventor 井敏
Owner 井敏
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