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Chip-level underfill adhesive and preparation method thereof

An underfill and chip-level technology, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of uneven dispersion of tougheners and large phase separation scales, and achieve toughening efficiency High, small phase split size, high reliability effect

Pending Publication Date: 2022-05-13
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Aiming at the technical problem that the traditional toughening agent has a large phase separation size after the resin matrix is ​​cured and the toughening efficiency is not high, the present invention provides a "carrier" uniform dispersion technology, small-size phase separation technology, and micro-dispersion technology to solve the problem The problem of uneven dispersion of toughening agent / excessive phase separation scale in the traditional toughening method of underfill rubber can effectively improve toughness without loss of strength, and maintain viscosity, fluidity, modulus and other properties

Method used

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  • Chip-level underfill adhesive and preparation method thereof
  • Chip-level underfill adhesive and preparation method thereof
  • Chip-level underfill adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0102] For the preparation of the chip-level underfill in this embodiment, see figure 2 ,Specific steps are as follows:

[0103] Step 1: Disperse 120 g of spherical silica (component D2, average particle size 15 μm) prepared by the melting method in 500 mL of a mixed solvent of ethanol and water (ethanol:water volume ratio 90:10), and add 1 g of 3- Aminopropyltrimethoxysilane, stirred and refluxed at 80°C for 12h, cooled and centrifuged to remove the ungrafted silane coupling agent on the surface, and dried at 100°C for 4h to obtain surface-modified amino-functionalized silica powder; Disperse 60 g of the obtained amino-functionalized silica powder in 500 mL of methyl ethyl ketone solvent, add 1 g of carboxyl-terminated acrylic rubber copolymer LA2250 (toughener C1), react at 80 ° C for 5 h, and then centrifuge and dry to obtain toughened Filler D1;

[0104] Step 2: Weigh 30g of bisphenol A epoxy resin (component A1), and mix at a high speed of 1000rpm / min for 2min;

[010...

Embodiment 2

[0109] For the preparation of the chip-level underfill in this embodiment, see figure 2 ,Specific steps are as follows:

[0110] Step 1: Disperse 240 g of spherical silica (component D4, average particle size 2 μm) prepared by deflagration method in 500 mL of a mixed solvent of ethanol and water (volume ratio of ethanol:water 80:20), and add 0.5 g of 3-Aminopropyltriethoxysilane, stirred and refluxed at 60°C for 24h, cooled and centrifuged to remove ungrafted silane coupling agent on the surface, and dried at 120°C for 6h to obtain surface-modified amino-functionalized silica Powder: Disperse 60g of the obtained amino-functionalized silica powder in 1000mL butanone solvent, add 1g of carboxy-terminated acrylic rubber copolymer LA2230 (toughener C2), react at 60°C for 2h, then centrifuge, wash and dry , to obtain the toughening filler D3;

[0111] Step 2: Weigh 27.38g of bisphenol F epoxy resin (component A2), and mix at a high speed of 1500rpm / min for 1min;

[0112] Step 3...

Embodiment 3

[0116] For the preparation of the chip-level underfill in this embodiment, see figure 2 ,Specific steps are as follows:

[0117] Step 1: Disperse 360g of spherical silica (component D6, average particle size 0.5μm) prepared by deflagration method in 500mL of mixed solvent of ethanol and water (volume ratio of ethanol:water 60:40), and add 2g of 3- (Triethoxysilyl) propyl succinic anhydride, stirred and refluxed at 70°C for 12h, cooled and centrifuged to wash, remove the ungrafted silane coupling agent on the surface, and dry at 140°C for 2h; the obtained surface-modified silica Disperse 120g of powder in 500mL of acetone solvent, add 2g of epoxy-modified silicone oil X22-343 (toughener C3), react at 60°C for 2h, then centrifuge, wash and dry to obtain toughening filler D5;

[0118] Step 2: Weigh 18.28g of naphthalene ring epoxy resin (component A3), and mix at a high speed of 1500rpm / min for 1min;

[0119] Step 3: Weigh 61g of the toughening filler (component D5) obtained i...

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Abstract

The invention discloses a chip-level underfill adhesive and a preparation method thereof, and the chip-level underfill adhesive comprises the following components in parts by mass: 10-30 parts of epoxy resin; 5-25 parts of a curing agent; 45 to 75 parts of toughening filler; wherein the toughening filler is a composite particle which takes a spherical inorganic particle as a core and is grafted with a toughening agent after the surface of the spherical inorganic particle is modified by a silane coupling agent; preferably, the silane coupling agent is selected from one or more of compounds as shown in a formula (1). The spherical inorganic particles are used as a carrier to realize uniform dispersion of the filler and the flexibilizer in an epoxy resin matrix, the inorganic particles are used as a stress bearing framework to induce and transfer stress, the stress is dispersed through the surface grafted flexibilizer, the fracture toughness is remarkably improved while the strength is not lost, and the service life of the filler and the flexibilizer is prolonged. And meanwhile, the flexibilizer is inhibited from separating out split phases at the underfill. After a chip is filled with the filling adhesive provided by the invention, no crack is generated in 1000 times of cold and hot cycles at the temperature of-45 to 125 DEG C, and the filling adhesive has relatively high reliability.

Description

technical field [0001] The invention relates to the technical field of electronic adhesives, in particular to a chip-level underfill adhesive and a preparation method thereof. Background technique [0002] Chip-level underfill is an epoxy polymer composite material filled with inorganic fillers. It is usually used to alleviate the stress concentration of the solder balls caused by the mismatch of thermal expansion coefficients between the chip and the substrate in flip-chip packaging, and improve the reliability of the package. sex. In order to better play the role of underfill in protecting solder balls and packaging structures, the coefficient of thermal expansion (CTE) of the underfill material is required to be as close as possible to the CTE of the interconnect structure (26ppm / K). CTE (60-70ppm / K), usually need to add a large amount of spherical silica filler (≥60wt%) to the matrix resin to reduce the CTE, and then match the CTE of the solder ball, and the introductio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08
CPCC09J163/00C09J11/04C09J11/08C08L2203/206C08L53/00C08K9/06C08K7/18
Inventor 李刚杨媛媛朱朋莉彭韬孙蓉
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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