Self-driven MSM ultraviolet detector and preparation method thereof
An ultraviolet detector, self-driven technology, applied in the direction of semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of low responsivity, low current, low collection efficiency, etc., and achieve the effect of separation promotion
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0048] The present invention also provides a method for preparing a self-driven MSM ultraviolet detector, comprising the following steps:
[0049] a) depositing a low-temperature crystalline layer raw material on the surface of the substrate to obtain a low-temperature crystalline layer;
[0050] The material of the low-temperature crystalline layer is nitride of wurtzite structure; the deposition temperature is 300-950°C;
[0051] b) performing a patterning process on the low-temperature crystal layer to obtain a substrate with a patterned low-temperature crystal layer on the surface;
[0052] c) performing high temperature epitaxial growth on the surface of the substrate obtained in step b) to obtain a high temperature epitaxial layer;
[0053] The material of the high-temperature epitaxial layer is a nitride of wurtzite structure, and the temperature of the high-temperature epitaxial growth is 1000-1200° C.;
[0054] The high-temperature epitaxial layer epitaxially obtain...
Embodiment 1
[0069] To prepare a self-driven MSM UV detector, the specific steps are as follows:
[0070] a) A 20nm AlN low temperature crystalline layer was deposited on a 2-inch flat sapphire based on MOCVD technology; wherein, the deposition temperature of the crystalline layer was 850°C, the deposition pressure was 150torr, and the aluminum source used for the deposition was trimethylaluminum (TMA). ), the nitrogen source is ammonia (NH 3 ).
[0071] b) Spin-coat 1.5 μm thick photoresist on the surface of the substrate deposited with the low-temperature crystalline layer, use a contact exposure apparatus to expose and develop, and form an interdigitated patterned structure on the photoresist layer; wherein, the exposure time is 8 seconds, the development time is 30 seconds; the interdigital structure period values are 16 and 24 microns, respectively, and the length is 500 microns.
[0072] c) Based on plasma etching, remove the AlN low temperature crystalline layer of the exposed p...
Embodiment 2
[0078] a) A 50nm AlN low-temperature crystalline layer was deposited on a 2-inch flat sapphire based on magnetron sputtering technology; wherein, the deposition temperature of the crystalline layer was 400°C, and the deposition pressure was 3×10 -5 Pa, the aluminum source used for deposition is metal aluminum target, and the nitrogen source is nitrogen (N 2 ).
[0079]b) patterning the surface of the sapphire substrate deposited with the AlN low temperature crystalline layer by step exposure technology to form an interdigitated patterned structure; wherein the interdigitated structure has a period value of 16 microns and a length of 500 microns.
[0080] c) depositing a Ti etching barrier layer with a thickness of 50 nm; etching the lower AlN low-temperature crystalline layer based on wet etching technology; wherein, the etchant used is 3 mol / L KOH aqueous solution, and the etching temperature is 70°C; after the etching, use deionized water to clean the sample, and then use H...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com