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Chip manufacturing method, chip connecting method and chip

A production method and connection method technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve problems such as solder diffusion and chip failure, and achieve stable performance

Inactive Publication Date: 2022-06-21
甬矽半导体(宁波)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of this application is to provide a method for manufacturing a chip, a method for connecting a chip, and a chip, so as to solve the problem in the prior art that when soldering a chip, the solder will diffuse to the electroplated copper column, causing the chip to fail

Method used

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  • Chip manufacturing method, chip connecting method and chip
  • Chip manufacturing method, chip connecting method and chip
  • Chip manufacturing method, chip connecting method and chip

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Embodiment Construction

[0045] After making the chip theme, a layer of photoresist can be coated on the surface of the chip body, and the structure after coating the photoresist is as follows Figure 4 shown. Figure 4 In , the chip body includes electrodes, and the chip body also includes a metal layer, wherein the metal layer may be multi-layered, such as Figure 4 Among them, the metal layer can be two layers, and the metal layer can be used to realize different functions, for example, to realize Schottky contact, etc., which is not limited here. In the manufacturing process of the present application, the metal layer is actually deposited first, then photoresist is coated on the surface of the metal layer, and the photoresist is grooved to form plating holes.

[0046] It should also be noted that in the chip manufacturing process, multiple chips are actually manufactured at the same time, such as Figure 4 , shows the production of two chips, one chip is on the left side of the dotted line A, a...

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Abstract

The invention provides a chip manufacturing method, a chip connecting method and a chip, and relates to the technical field of semiconductor processes. The method comprises the following steps: firstly, manufacturing connecting metal and welding metal based on an electrode of a chip main body, then placing the chip main body after the connecting metal and the welding metal are manufactured in a nitrogen and oxygen environment, and baking within a preset time to form a protective layer on the side wall of the connecting metal, the protective layer is used for inhibiting diffusion of welding metal to connecting metal during welding. The chip manufacturing method, the chip connecting method and the chip provided by the invention have the advantage of better performance after welding.

Description

technical field [0001] The present application relates to the technical field of semiconductor technology, and in particular, relates to a method for manufacturing a chip, a method for connecting a chip, and a chip. Background technique [0002] Copper pillar bump (Copper Pillar Bump) technology is to manufacture soldering bumps on the surface of the flip-chip package chip, so that it has better electrical conductivity, thermal conductivity and anti-electromigration capabilities. The use of copper pillar bump flip-chip packaging instead of traditional wire-bonding packaging can shorten the length of the connecting circuit to reduce the size of the chip packaging area, realize miniaturization, and reduce the interference of chip system parasitic capacitance, resistance heating and signal delay. And other shortcomings, improve the chip packaging module performance. [0003] However, in the prior art, when the finished chip is welded to the carrier board, a large amount of sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L21/603
CPCH01L24/11H01L24/81H01L24/13H01L24/16H01L2224/13486H01L2224/16225H01L2224/81203H01L2224/11
Inventor 王森民白胜清
Owner 甬矽半导体(宁波)有限公司
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