Heat-conducting anisotropic polyamide-imide composite material and preparation method thereof

A technology of polyamide-imide and composite materials, which is applied in the field of thermally conductive anisotropic polyamide-imide composite materials and its preparation, can solve problems such as unsatisfactory mechanical properties, ensure processing performance and mechanical properties, and reduce additives Quantity, the effect of not easy to reunite

Pending Publication Date: 2022-07-12
ZHUZHOU TIMES NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the addition of boron nitride powder is optimized in this patented technology, the tensile strength of the composite material obtained is about 50MPa, and the mechanical properties are still not ideal.

Method used

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  • Heat-conducting anisotropic polyamide-imide composite material and preparation method thereof
  • Heat-conducting anisotropic polyamide-imide composite material and preparation method thereof
  • Heat-conducting anisotropic polyamide-imide composite material and preparation method thereof

Examples

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Effect test

Embodiment 1

[0052] A preparation method of a thermally conductive anisotropic polyamide-imide composite material, comprising the following steps:

[0053] (1) Dissolve the polyamideimide powder in DMF, the mass ratio is polyamideimide:DMF=1:4, stir and disperse evenly, then ultrasonically vibrate for 1h, and after all the materials are dissolved, polyamideimide is obtained Amine powder solution.

[0054] The h-BN micro-nano powder is treated with mixed acid, wherein the hexagonal boron nitride micro-nano powder is obtained by high-speed mixing of hexagonal boron nitride powder with an average particle size of 50 μm and 30 nm, the mass ratio is 10:3, and the mixed acid is The mixed acid of concentrated nitric acid and concentrated sulfuric acid, the volume ratio is concentrated nitric acid: concentrated sulfuric acid = 1:1, the mass ratio is hexagonal boron nitride: mixed acid = 1:25, after stirring and ultrasonic dispersion at room temperature for 1 hour, in a water bath of 80 ° C The re...

Embodiment 2

[0062] The raw materials used in this example are exactly the same as those in Example 1. The difference is that in this example, a composite material with thermal conductivity anisotropy is obtained by extrusion molding, wherein the thickness of the extrusion die is 1 mm and the width is 50 mm.

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Abstract

The invention provides a heat-conducting anisotropic polyamide-imide composite material and a preparation method thereof, and solves the problem of contradiction between the heat-conducting property and the mechanical property of polyamide-imide in the prior art. The composite material comprises the following raw materials in parts by weight: 100 parts of polyamideimide; 10 to 30 parts of hexagonal boron nitride; 0.5 to 2 parts of a coupling agent; 1-2 parts of polyamide acid; 0.05 to 0.1 part of a condensing agent; the hexagonal boron nitride is hexagonal boron nitride micro-nano powder obtained by compounding micron-sized hexagonal boron nitride and nano-sized hexagonal boron nitride. The hexagonal boron nitride with insulativity is used as a heat-conducting filler, the addition amount of the filler is reduced through micro-nano compounding of the hexagonal boron nitride, and meanwhile, the hexagonal boron nitride is subjected to surface treatment to improve the compatibility with a matrix; the dispersity of the heat-conducting filler is improved by adopting a solution blending mode; and the melt is sheared by adopting melting processing, so that the heat-conducting anisotropic polyamide-imide composite material with highly-oriented filler is formed.

Description

technical field [0001] The invention belongs to the field of polymer materials, in particular to a thermally conductive anisotropic polyamide-imide composite material and a preparation method thereof. Background technique [0002] With the rapid development of information technology, electronic products are developing in the direction of integration and light weight, and the problem of local heat dissipation needs to be solved urgently. Polyamide-imide (PAI) is a high-performance engineering plastic with excellent high and low temperature resistance, electrical insulation, mechanical properties and corrosion resistance, so it is widely used in the field of electronic components. Due to the low thermal conductivity of PAI, which is not conducive to heat dissipation, its application as a thermal interface material is limited. [0003] In order to improve the thermal conductivity of polymers, it is a common practice for researchers to introduce high thermal conductivity filler...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/38C08K9/02C08K9/06C08K9/04B29B11/08B29B11/10B29B11/16B29B9/06
CPCC08K3/38C08K9/02C08K9/06C08K9/08B29B11/08B29B11/10B29B11/16B29B9/06C08K2003/385C08K2201/011C08L79/08
Inventor 胡梦龙杨海洋甘顺昌许双喜彭超义
Owner ZHUZHOU TIMES NEW MATERIALS TECH
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