Compound for thin film packaging, composition and packaging thin film

A technology of thin film encapsulation and composition, which is applied in the fields of compounds, organic chemistry, chemical instruments and methods of group 4/14 elements of the periodic table, can solve the problems of reducing water and oxygen transmission rate, and achieve good heat resistance, Improvement of reliability and effect of low water vapor transmission rate

Pending Publication Date: 2022-08-05
JILIN OPTICAL & ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention provides a compound, composition and packaging film for thin film packaging, to solve the problem that the surface of the organic film is etched in the above background technology, reduce the water oxygen transmission rate, and prolong the service life of the device

Method used

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  • Compound for thin film packaging, composition and packaging thin film
  • Compound for thin film packaging, composition and packaging thin film
  • Compound for thin film packaging, composition and packaging thin film

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0037] Production Example 1 Production of Compound 1 of Formula 101

[0038] 4,4'-(3,6-bis(trimethylsilyl)-9H-fluorene-9,9-diacyl)bisphenol (chemical formula 1) 52.2 g and 2-isocyanate ethyl methacrylate (chemical formula 2) 35.7 g was added to 150 mL of toluene to dissolve, and 0.3 g of dibutyltin dilaurate was added, followed by stirring for 4 hours while heating at 60°C. The temperature was cooled to room temperature, and the solvent was removed using a reduced pressure distiller to obtain 49.1 g of Compound 1 of Formula 101.

[0039]

[0040] The compound 1 was detected and analyzed, and the specific results were as follows:

[0041] HPLC purity: greater than 90%.

[0042] Mass Spec: Calculated 805.09; Tested 804.32.

[0043] Elemental analysis:

[0044] Calculated values: C: 67.13%; H: 6.51%; N: 3.48%; O: 15.90%; Si: 6.98%.

[0045] Tested values: C: 68.33%; H: 6.81%; N: 3.11%; O: 15.26%; Si: 6.49%.

manufacture example 2

[0046] Production Example 2 Production of Compound 2 of Formula 102

[0047] 4,4'-(3,6-bis(trimethylsilyl)-9H-fluorene-9,9-diacyl)diphenylamine (chemical formula 3) 52g and 2-isocyanate ethyl acrylate (chemical formula 4) 32.5 g g was added to 150 mL of toluene to dissolve, and 0.3 g of dibutyltin dilaurate was added, followed by stirring for 4 hours while heating at 60°C. The temperature was cooled to room temperature, and the solvent was removed using a reduced pressure distiller to obtain 46.6 g of compound 2 of formula 102.

[0048]

[0049] The compound 1 was detected and analyzed, and the specific results were as follows:

[0050] HPLC purity: greater than 90%.

[0051]Mass Spec: Calculated 775.07; Tested 774.26.

[0052] Elemental analysis:

[0053] Calculated values: C: 66.64%; H: 6.50%; N: 7.23%; O: 12.39%; Si: 7.25%.

[0054] Tested values: C: 67.59%; H: 6.91%; N: 6.81%; O: 11.73%; Si: 6.96%.

manufacture example 3

[0055] Production Example 3 Production of Compound 3 of Formula 103

[0056] 4,4'-(3,6-bis(trimethylsilyl)-9H-fluorene-9,9-diacyl)bisphenol (chemical formula 1) 52.2 g and 2-isocyanate propyl acrylate (chemical formula 5) 35.7 g was added to 150 mL of toluene to dissolve, and 0.3 g of dibutyltin dilaurate was added, followed by stirring for 4 hours while heating at 60°C. The temperature was cooled to room temperature, and the solvent was removed using a reduced pressure distiller to obtain 41.9 g of compound 3 of formula 103.

[0057]

[0058] The compound 1 was detected and analyzed, and the specific results were as follows:

[0059] HPLC purity: greater than 90%.

[0060] Mass Spec: Calculated 805.09; Tested 804.33.

[0061] Elemental analysis:

[0062] Calculated values: C: 67.13%; H: 6.51%; N: 3.48%; O: 15.90%; Si: 6.98%.

[0063] Tested values: C: 68.52%; H: 6.80%; N: 3.08%; O: 15.14%; Si: 6.46%.

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Abstract

The invention discloses a compound for thin film packaging, a composition and a packaging thin film. The composition with the compound structure comprises a component A, a component B and a component C, wherein the component A is the compound for thin film packaging; the component B is a methacrylate monomer, an acrylate monomer, a methacrylate oligomer or an acrylate oligomer; the component C is a photopolymerization initiator and/or a free radical polymerization initiator; the packaging film comprises inorganic layers and organic layers which are alternately arranged in sequence, and the organic layers comprise the composition for film packaging. The problem that the surface of the organic film is etched is solved, the water and oxygen transmittance can be reduced, and the service life of a device is prolonged.

Description

technical field [0001] The present invention relates to the technical field of thin film encapsulation, and more particularly to a compound, a composition and an encapsulation film for thin film encapsulation. Background technique [0002] An organic light-emitting diode (OLED) display includes a hole-injecting electrode (anode), an organic light-emitting layer, and an electron-injecting electrode (cathode). The organic light-emitting device is usually attached on a substrate made of glass and covered by another substrate to prevent deterioration due to moisture or oxygen introduced from the outside. Nowadays, organic light emitting display devices are becoming thinner and thinner with the demands of consumers. In order to solve this problem, thin film encapsulation (TFE) structure is adopted in organic light emitting display devices. [0003] The thin-film encapsulation structure covers the display area of ​​the substrate (that is, above the organic light-emitting device),...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07F7/10C08F222/20C08F230/08C09D135/02H01L51/52
CPCC07F7/081C07F7/083C08F222/103C09D143/04H10K50/8445C08F230/085C08F2500/26Y02E10/549
Inventor 姜晓晨于哲尹恩心马晓宇王辉
Owner JILIN OPTICAL & ELECTRONICS MATERIALS
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