Photosensitive resin composition of aqueous emulsion type

A photosensitive resin, water emulsion technology, applied in optics, optomechanical equipment, instruments, etc., can solve problems such as fire risk control and environmental pollution

Inactive Publication Date: 2004-06-30
GOO CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, the application of organic solvents causes problems of industrial safety, environmental pollution, fire risk control, etc., which remain unsolved in the process of forming a pre-dried film after its application to the substrate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment I-1 to I-20

[0149] In Examples I-1 to I-20, the aqueous emulsion type photosensitive resin compositions were all prepared in the following ways. The ingredients of the composition given in Table 1 were added and the mixture thus obtained was stirred and mixed well. The resulting mixture was then thoroughly dispersed with a homomixer and heated until the liquid temperature reached 65°C. Finally, the organic solvent components are removed under blast conditions.

[0150] Comparative Examples I-1 to I-6

[0151] In Comparative Examples I-1 to I-6, the photosensitive resin compositions were prepared in the following ways, respectively. The ingredients of the composition given in Table 1 or 2 were added, the mixture thus obtained was stirred, mixed, thoroughly kneaded for Comparative Examples I-1 to I-3, while Comparative Examples I-4 to I-6 used 3 Roller kneads well.

[0152] [Table 1]

[0153] Example

Comparative example

I-1

I-2

I-3

I-4

I-5

...

Embodiment II-1

[0205] Under stirring and emulsification, 15 g of benzoin isobutyl ether, 75 g of pentaerythritol triacrylate and 75 g of Aronix M-8030 (polyester acrylate produced by Toagosei Co., Ltd.) were added to 200 g of Synthesis Example 1 to obtain In the water-insoluble photopolymer emulsion (A-1). To this emulsion, 90 g of water and 6 g of Blue-FLB conc. (a blue pigment dispersed in water produced by Dainichiseika Colour & Chemicals Ltd. Co., Ltd.) were mixed to obtain a photosensitive liquid (Sample II-1).

[0206] The preparation of the photosensitive film including the total thickness of the screen thickness of 80 μm was completed by repeating the following steps 3 times: the above-mentioned photosensitive liquid was coated on a 225-mesh polyester screen with a bucket (yellow), dried (at 30-40 ℃ hot air drying). The screen photosensitive film was brought into good contact with a positive film for preparing a printed circuit board, and then exposed for 30 seconds at a distance of...

Embodiment II-2

[0210] Under stirring and emulsification, to 200 g of the water-insoluble photosensitive polymer emulsion (A-1) obtained in Synthesis Example 1, 60 g of LIGHT-ACRYLATE HOA-HH (2- Acryloyloxyethylhexahydrophthalic acid), 20g LIGHT-ACRYLATE PO-A (phenoxyethyl acrylate produced by Kyoeisha Yushi Kagaku Kogyo Co., Ltd.), 20g ACRYESTER TMP (produced by Mitsubishi Rayon Co. ., Ltd. produced trimethylolpropane trimethacrylate), 5 g of photopolymerization initiator: Irgacure 907 (2-methyl-1-[4-(methylsulfide) produced by Ciba-Geigy Corp. phenyl]-2-morpholino-propan-1-one), 5g Kayacure DETX (4-diethylthioxanthone produced by NipponKayaku Co., Ltd.) and 50g LMS-100 (produced by Fuji TalcIndustrial Co. , Ltd. produced a mixture of talc). In this emulsion, 80 g of water and 6 g of Blue-FLB conc. (a blue pigment dispersed in water produced by Dainichiseika Color & Chemicals Mfg. Co., Ltd.) were mixed to obtain a photosensitive liquid (Sample II-2) .

[0211] According to the method of E...

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Abstract

Present invention provides an aqueous emulsion type photosensitive resin composition which forms a cured film significantly superior in water and solvent resistances in comparison with the conventional aqueous emulsion type photosensitive resin compositions. This photosensitive resin composition contains (A) an emulsion of a photosensitive water-insoluble polymer, the emulsion being obtained by reacting (i) an aqueous polymer emulsion whose main ingredient is a water-insoluble polymer and which contains a polymer having a hydroxyl group with (ii) an N-alkylol(meth)acrylamide, (B) a compound having a photoreactive ethylenically unsaturated group, and (C) a photopolymerization initiator.

Description

technical field [0001] The present invention relates to an aqueous emulsion type photosensitive resin composition. [0002] More specifically, the present invention relates to an aqueous emulsion type photosensitive resin composition capable of being developed with water or a dilute alkaline aqueous solution, which is particularly useful as a photoresist ink for the preparation of a printed circuit board. [0003] Furthermore, the present invention relates to a photosensitive resin composition having good sensitivity, water resistance and solvent resistance. The photosensitive resin composition of the present invention is used for screen printing stencils and photosensitive printing inks. The composition is also useful as an etching resist, a plating resist ink and a solder resist ink for the preparation of printed circuit boards. Background technique [0004] Photoresist inks developed using dilute aqueous alkaline solutions do not require solvents for development. The i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/033G03F7/038G03F7/12
CPCG03F7/033G03F7/038G03F7/12Y10S430/112Y10S430/11G03F7/0388C08L101/08
Inventor 森垣敏夫松本匡民
Owner GOO CHEM IND
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