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Method for preparing crystalline copper powder

A technology of copper powder and crystallization, which is applied in the field of preparation of crystalline copper powder, can solve problems such as wide particle size distribution, poor dispersion performance, and easy agglomeration of copper powder, and achieve narrow particle size distribution, good dispersion, and energy saving. Effect

Inactive Publication Date: 2006-01-25
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The copper powder prepared by these two methods has a brighter color and is not easy to oxidize, but due to the reaction at a higher temperature (usually 160-250 ° C), the copper powder is easy to agglomerate, the dispersion performance is not good, and the particle size distribution wider
In addition, the high reaction temperature is also a disadvantage in terms of energy consumption.

Method used

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  • Method for preparing crystalline copper powder
  • Method for preparing crystalline copper powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Disperse 5.47 g of cuprous oxide in 50 ml of water, add 0.78 g of cetyltrimethylammonium bromide and 0.36 g of glycine, and raise the temperature to 65°C. Add 12.5% ​​hydrazine hydrate solution into the above reaction solution under thorough stirring. After 1.5 hours of reaction at 65°C the product was filtered, washed well and dried in vacuo. The obtained copper powder is bright pink and has obvious metallic luster. from figure 1 It can be seen in the figure that the particles are spherical and crystalline polyhedral, the particles are dispersed and not adhered to each other, and the size distribution is 3-5 μm.

Embodiment 2

[0020] Disperse 3.60 g of cuprous oxide in 50 ml of water, add 1.82 g of cetyltrimethylammonium bromide and 1.90 g of glycine, and raise the temperature to 65°C. Add 12.5% ​​hydrazine hydrate solution into the above reaction solution under thorough stirring. After 0.5 hour reaction at 65°C the product was filtered, washed well and dried in vacuo. The scanning electron microscope picture of the product shows that the shape of the copper powder particles is spherical, and the size distribution is 0.8-1.2 μm.

Embodiment 3

[0022] Disperse 3.55 g of cuprous oxide in 50 ml of water, add 1.54 g of dodecyltrimethylammonium bromide and 0.37 g of glycine, and raise the temperature to 65°C. Add 12.5% ​​hydrazine hydrate solution into the above reaction solution under thorough stirring. After reacting at 65°C for 1.0 hour the product was filtered, washed well and dried under vacuum. The scanning electron microscope picture of the product shows that the shape of the copper powder particles is spherical, and the size distribution is 1.5-2.5 μm.

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Abstract

The preparation process of crystallized copper powder includes the following steps: dissolving amino acid or its salt as reaction promoter and alkyl quarternary ammonium salt surfactant as dispersant inside polar liquid phase reaction medium; adding copper oxide or hydroxide as reaction initiator and hydrazine or its compound as reductant; and reaction at 40-100 deg.c to synthesize copper powder. The prepared copper powder is in spherical or polyhedral shape, and has good dispersivity, average size of 0.5-5 micron and homogeneous size distribution.

Description

technical field [0001] The invention relates to a method for preparing crystalline copper powder, in particular to a method for preparing crystalline copper powder with spherical or polyhedral shape, good dispersion and uniform particle size distribution. Background technique [0002] Copper-based conductive pastes are widely used to form external electrodes on ceramic electronic components such as chip capacitors and chip resistors, and to form printed circuits on ceramic and plastic substrates. In order to form external electrodes or printed circuits, the conductive paste is applied to the substrate by coating or printing, and the electrodes are formed directly after drying, or sintered in a non-oxidizing atmosphere or a weakly oxidizing atmosphere to form electrodes. In order to meet the requirements of the rheology and thixotropy of the conductive paste and the electrical conductivity of the electrode, the copper powder used for the conductive past...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/20B22F9/24
Inventor 符小艺凌志远
Owner SOUTH CHINA UNIV OF TECH
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