Ultrathin pinless packaging process of integrated circuit and discrete component and its packaging structure

A discrete component, integrated circuit technology, applied in the field of integrated circuit or discrete component ultra-thin leadless packaging process and its packaging structure, can solve the problems of rigid arrangement, high electroplating cost, discount on utilizability, etc., achieve high transmission and heat dissipation, The effect of low material cost and stable quality
CN1295768CActive Publication Date: 2007-01-17长电科技管理有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
长电科技管理有限公司
Publication Date
2007-01-17

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Abstract

The invention discloses an ultrathin encapsulation technology of integrate circuit or discrete component and includes the following steps: get basal plate, coat dry ink on the basal plate, etch the chip area and inner area of the throwing on the basal plate, coat a film of metals, metallic active layer, copper or alloy layer on the basal plate, plate a coat of argentine or nickel or palladium over the copper or alloy layer in the throwing area, divest the dry ink layer, coat argentine sol on the copper or alloy layer in the chip area, imbed the chip in the argentine sol, throw, encapsulate, print it with laser printer, divest the metallic basal plate, stick it on the blue cutan and comminute the encapsulating bodies. The invention is featured by strong welding, good quality, low cost, smooth production, strong applicability, highest efficiency of the cutting machines and blades, flexible arrangement of the chips and environmental protection and the trouble of the infiltration of plastics won't happen.
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Description

Technical field:

[0001] The invention relates to an ultra-thin and footless packaging process for integrated circuits or discrete components and a packaging structure thereof. It belongs to the technical field of packaging of integrated circuits or discrete components. Background technique:

[0002] The traditional ultra-thin and footless packaging process of integrated circuits or discrete components and its packaging structure, its packaging type is an array-type assembly that is cut into a single unit. Its substrate type is etched. It mainly has the following deficiencies:

[0003] 1. Special adhesive tape is required. In order to prevent the plastic from penetrating into the lead frame during high-pressure encapsulation, increasing the risk of solder joint insulation, and if the post-treatment of plastic penetration occurs, it is easy to destroy the metal layer of the solder joint. Affects weldability, so material cost, post-processing cost and quality all have a cert...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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