Epoxy modified lacquer putty

An epoxy modification and putty technology, applied in the direction of filling slurry, etc., can solve the problems that thick and thin coatings cannot be cured simultaneously, affect the construction progress, and shorten the use time, so as to improve sag resistance, improve comprehensive performance, Strong adhesion effect

Inactive Publication Date: 2003-05-07
ZHUZHOU HUALIAN HI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The putty is mainly composed of mixed unsaturated resin, which has the advantages of fast drying and solidification of putty putty, strong adhesion, good flexibility, sandability, brushing property, etc., and shortens the initial curing time. However, due to the The resin is still the unsaturated polyester resin commonly used in putty putty, which fails to solve the main defect of putty putty—the problem of short service time, which requires fast operation, and thick and t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Make putty according to the component listed formula 1 in table 1. The epoxy-modified unsaturated polyester resin used is a main chain composed of the aforementioned schematic repeating structural units, the molecular weight is 1000-2000, and the grafting ratio of the alkyd group and the epoxy group is 25%- 29% epoxy-modified unsaturated polyester resin; functional filler is a mixture of mica powder, zinc oxide and white ivy; stabilizer is hydroquinone; drier is cobalt naphthenate; reactive diluent is styrene , a mixture of vinyl toluene and vinyl acetate; the official polymer is vinylpyrrolidone.

[0045] The technical indicators of the resulting product are listed in Table 1.

Embodiment 2

[0047] Putty was made according to the components of formula 2 listed in table 1. Compared with Example 1, the difference is that the drier is cobalt isooctanoate. The reactive diluent is a mixture of styrene and vinyltoluene. The stabilizer is diphenoquinone. The functional polymer is vinylpyrrolidone.

[0048] The technical indicators of the resulting product are listed in Table 1.

Embodiment 3

[0050] Make putty according to the composition of formula 3 listed in table 1. Compared with Example 1, the difference is that the stabilizer is p-benzoquinone, and the drier is cobalt isooctanoate. The reactive diluent is a mixture of vinyl toluene and vinyl acetate. The functional polymer is vinylpyrrolidone.

[0051] The technical indicators of the resulting product are listed in Table 1.

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PUM

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Abstract

An epoxy modified puddy for metallic materials is composed of components A and B. Said component A is prepared from epoxy modified unsaturated polyester resin, functional filler, quinone substance, cobalt naphthenate (or isooctoate), polyvinyl chloride or SiO2 gas, and active diluent. Said component B is vinylamide polymer. Its advantages are long application time (60 min) and high low-temp high-moisture performance.

Description

technical field [0001] The invention relates to a primer coating material in large-area embedded filling materials on metal surfaces required by trains, automobiles, machine tools, shipbuilding and motor manufacturing industries, in particular to an epoxy-modified unsaturated putty. Background technique [0002] In the background technology, commonly used putties include alkyd putty, epoxy putty and putty putty, among which the putty with unsaturated polyester resin as the main raw material has good overall performance. Chinese patent application 94115901 discloses a formula of "quick-drying high-grade polymerized putty at normal temperature" and its production method. It discloses the formula of A component and B component, and the formula (weight ratio) of its A component is: 100 parts of saturated resin, 80-90 parts of talcum powder, 5-10 parts of paris plaster powder, 5-10 parts of heavy calcium carbonate, 5-10 parts of light calcium carbonate, 15-25 parts of quartz sand...

Claims

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Application Information

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IPC IPC(8): C09D5/34
Inventor 刘之礼谭湘文
Owner ZHUZHOU HUALIAN HI TECH
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