Packaging bag and its making method
A packaging bag and film layer technology, which is applied in the field of packaging supplies, can solve problems such as difficulty, high manufacturing cost, and impracticality, and achieve the effect of scientific materials, scientific selection, and ideal effects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0037] refer to Figure 1A As shown, the present invention provides a film layer structure 100 which is a layer of heat-sealable material capable of heat melting, and the film layer 10 shown in it is selected from acrylic, polyester, polyethylene, PE), polypropylene (polypropylene, PP), polythiamine (polyamide, nylon), polyethylene and polypropylene copolymer, ethylene and styrene copolymer (ethylene-styrenecopolymer, ES), cyclic olefin copolymer Polymer (cyclo olefin), polyethylene terephthalate (polyethylene terephthalate, PET), polyvinyl alcohol (polyvinyl alcohol, PVA), ethylene-vinylacetate (EVA), or made of (SurlynTm (Dupontionomer Ionic polymer compound trade name), polyethylene glycol terephthalate (polyethylene naphthalate, PEN), polyether ketone (poly ether ketone, PEEK), polycarbonate (polycarbonate, PC), polysulfone (polysulfone ), polyimide (PI), polyacrylonitrile (PAN), styrene and acrylonitrile copolymer (styrene acrylonitrile, SAN), polyurethane (polyurethane, ...
PUM
Property | Measurement | Unit |
---|---|---|
size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com