Water-thinned isocyanate adhesive with corn starch as main material and its prepn process

A technology of water-based isocyanate and corn starch, applied in the direction of starch adhesives, adhesive types, etc., can solve the problems of restricting wide application, short active period, high cost, etc., and achieve the effect of standardized process, easy operation and low price

Inactive Publication Date: 2005-09-28
时君友
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Water-based isocyanate adhesive is a non-formaldehyde adhesive, which completely solves the problem of formaldehyde release. However, water-based isocyanate adhesive still has disadvantages such as high viscosity, short active period, and high cost, which limit its wide application in wood glued products.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-3

[0018] Embodiment 1-3: Preparation of raw material composite modifier for adhesive of the present invention

[0019] The raw materials and consumption used in each embodiment are shown in Table 1.

[0020] Example

1

2

3

Sodium carboxymethyl cellulose

8kg

10kg

12kg

sodium bisulfate

2kg

4kg

6kg

water

102kg

80kg

110kg

[0021] Preparation method: (taking Example 1 as an example, other examples are the same as Example 1 except the raw material consumption)

[0022] 8kg sodium carboxymethyl cellulose, 2kg sodium bisulfate and 102kg water were mixed and stirred evenly at normal temperature to obtain a composite modifier, which was set aside.

Embodiment 4-6

[0023] Embodiment 4-6: the preparation of adhesive of the present invention

[0024] The raw materials and consumption used in each embodiment are shown in Table 2.

[0025] Example

Embodiment 4

[0026] Embodiment 4 preparation method:

[0027] (1) Preparation of the main ingredient: Add 100kg of cornstarch to 200kg of water and stir in an enamel kettle to make slurry, then add 0.2kg of ammonium persulfate, 8kg of maleic acid, and 17.5kg of sodium hydroxide in sequence at 40°C. The esterification reaction was carried out for 1.5 hours to obtain esterified cornstarch emulsion A; 6kg of polyvinyl alcohol and 11.2kg of compound modifier were added to 100kg of water, and dissolved into a uniform transparent liquid at 90°C to obtain compound tackifier B; After B is mixed, add 0.15kg of boric acid to a viscosity of 650mPa.s, adjust the pH value to 7 with sodium hydroxide, and then add 1kg of urea, 0.9kg of a conventional preservative quaternary ammonium salt, and 0.9kg of an antifreeze agent hexylene glycol. to room temperature to obtain the main agent;

[0028] (2) Preparation of curing agent: Grind 1 kg of sodium bisulfite to a 500-mesh fine powder, and slowly and evenly ...

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PUM

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Abstract

The present invention belongs to the field of adhesive technology, and features that the present invention is double component no-aldehyde waterproof timber adhesive comprising main adhesive component, which is prepared with corn starch and through esterification to form emulsion and copolymerization with grafting stabilizer under certain pH condition, and curing agent, which is prepared with polyisocyanate through closing the isocyanate radical. The present invention has the features of unique composition, no environmental pollution, low cost, etc. and is used in various timber products.

Description

technical field [0001] The invention relates to a water-based isocyanate adhesive with corn starch as the main raw material and a preparation method thereof, belonging to the technical field of chemical adhesives. Background technique [0002] Water-based isocyanate glue is a non-formaldehyde adhesive, which completely solves the problem of formaldehyde release. However, water-based isocyanate glue still has disadvantages such as high viscosity, short active period, and high cost, which limit its wide application in wood glued products. Contents of the invention [0003] The object of the present invention is to provide a kind of water-based isocyanate adhesive that cornstarch is main raw material at above-mentioned deficiency. This kind of adhesive is not only non-toxic and pollution-free after the adhesive layer is cured, but also has the advantages of low manufacturing cost, long active period, low apparent viscosi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J103/02
Inventor 时君友
Owner 时君友
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