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Curable resin composition and products of curing thereof

A technology of resin composition and curable resin, which is applied in the direction of chemical instruments and methods, electrical solid devices, and other chemical processes, and can solve problems such as warping, cracking, peeling, and difficulty in use

Inactive Publication Date: 2006-02-08
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cured product obtained by thermal cationic polymerization of alicyclic epoxy resin will undergo curing shrinkage, and because of this curing shrinkage, internal stress will be generated, so that warping, cracks, peeling, etc. will easily occur, so it is difficult to Take advantage of shortcomings in fields that require precision adhesion

Method used

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  • Curable resin composition and products of curing thereof
  • Curable resin composition and products of curing thereof
  • Curable resin composition and products of curing thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] A blend containing 100 parts of alicyclic epoxy resin CEL2081, 0.6 parts of SI100L, and 0.1 parts of BYK333 was coated on a polyimide film, and after being cured by heating at 100°C for 1 hour, the The coating film was measured for warpage due to curing shrinkage, and as a result, the measurement method A was 10.0 mm, and the measurement method B was 4.0 mm.

Embodiment 2

[0083] A blend containing 100 parts of alicyclic epoxy resin CEL2081, 0.6 parts of SI100L, and 0.1 parts of FC430 is coated on a polyimide film, and after being cured by heating at 100°C for 1 hour, the coated The cloth film was measured for warpage due to curing shrinkage. As a result, the measurement method A was 7.0 mm, and the measurement method B was 2.3 mm.

Embodiment 3

[0085] A blend containing 80 parts of alicyclic epoxy resin CEL2021P, 20 parts of polycaprolactone triol PCL308, 0.6 part of SI100L, and 0.1 part of FC430 is coated on a polyimide film and heated at 65 ° C After 2 hours, it was further cured by heating at 150°C for 1 hour, and the warpage due to curing shrinkage was measured on the coated film. As a result, the measurement method A was 7.0 mm, and the measurement method B was 2.3 mm. .

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Abstract

The present invention provides a heat-curable resin composition which is curable and is capable of providing a cured product with low shrinkage in curing. The heat-curable resin composition of the present invention includes an alicyclic epoxy compound (a) having a structure represented by the following general formula (1). In the general formula (1): R<1> to R<10> each represent hydrogen, or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms, and an ether bond, an ester bond, or an alcoholic hydroxyl group may be included in the hydrocarbon group; R<1> to R<10> may each represent a residue derived by removing any one of R<1> to R<10> from the structure represented by the general formula (1), or a residue derived by removing hydrogen from any one of R<1> to R<10>; and the phrase 'in the hydrocarbon group' refers to 'inside the hydrocarbon group', 'at terminals of the hydrocarbon group', or 'within bonds of the hydrocarbon group', a cationic polymerization initiator (i), a surfactant (e), and optionally a polyol (b) having two or more hydroxyl groups on terminals.

Description

technical field [0001] The present invention relates to a thermosetting resin composition and a thermally cured product of the composition. The cured product has low curing shrinkage, so it can be effectively used as a raw material for an adhesive or an insulating sealant, especially for a precise position. Raw materials for adhesives or insulating sealants used in the assembly of precision optical parts or electronic parts. Background technique [0002] Conventionally, various curable resin compositions have been used as adhesives, sealants, etc.; among them, the solvent-free type has also been switched. However, a system for radically polymerizing an acrylic compound has problems such as insufficient curability due to inhibition of polymerization by oxygen, and strong monomer odor. [0003] Therefore, in JP-A-11-302358 (claims 1 to 4, paragraph 0012, Table 1), a photocurable composition containing at least a photocationically polymerizable compound and a photoacid generat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/24C08G59/68C08L63/00C09K3/10C08G59/32C08K5/00H01L23/29H01L23/31
CPCC08G59/3218C08G59/24C08G59/68
Inventor 前嶋尚
Owner DAICEL CHEM IND LTD