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High dielectric constant polyimide/ceramic complex film and its preparation method

A technology of ceramic composite film and high dielectric constant, which is applied in the field of high dielectric constant polyimide/ceramic composite film and its preparation, can solve the problem that the temperature resistance, chemical corrosion resistance strength and flexibility of the composite film cannot fully meet the use requirements , It is not easy to control the thickness of the composite film, the flatness and adhesion, the uniformity of the ceramic powder dispersion structure, etc., to achieve the effects of good chemical stability, high power, and strong heat generation

Inactive Publication Date: 2006-04-26
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However; these results are also accompanied by the following major problems: (1) due to the high enough dielectric constant of the ceramic powder used, the further improvement of the dielectric constant of the composite film is restricted; (2) due to the use of the polymer The problems of the matrix itself cause the composite membrane to fail to fully meet the use requirements in terms of temperature resistance, chemical corrosion resistance, strength, and flexibility; (3) The compatibility between the ceramic powder and the polymer matrix in the composite membrane is poor and the dispersion structure of the ceramic powder is uniform and (4) the molding method is not easy to control the thickness, flatness and adhesion between the film and the substrate or electrode, etc.

Method used

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  • High dielectric constant polyimide/ceramic complex film and its preparation method
  • High dielectric constant polyimide/ceramic complex film and its preparation method
  • High dielectric constant polyimide/ceramic complex film and its preparation method

Examples

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Effect test

Embodiment 1

[0068] 1) Modification of ceramic powder A1: Add 50g of A1 (A105) with an average particle size of 0.5μm into 200ml of absolute ethanol at room temperature, turn on ultrasound and stirring; add 1.25g of 3-aminopropyltriethoxysilane (APTES, U.S. Dow Corning Company, model: Z-6011) was heated to 65-70°C and stirred for 2 hours; then 10ml of deionized water was added and stirred for 2 hours; the powder was separated by filtration, washed with absolute ethanol three times, and vacuum After drying for 20 hours, it was sealed to obtain modified A1 (A105A), which was sealed and placed in a desiccator for later use.

[0069] 2) Preparation of PMDA / ODA PI / A105A non-crosslinked composite film by in-situ polymerization: 10g A105A and 5.214g (23.91mmol) pyromellitic dianhydride (PMDA, Shanghai Sanwei Industrial Co., Ltd.) monomer was added to 70ml In anhydrous N,N'-dimethylacetamide (DMAC), stir in an ultrasonic field at a temperature of 20-50°C for 2 hours, PMDA dissolves; cool the suspe...

Embodiment 2

[0074] (1) Modification of porcelain powder A1: A105 was replaced by A1 (A120) with an average particle size of 2.0 μm, and APTES modified A1 (A120A) was obtained according to the same operation as in Example 1 (1).

[0075] (2) In-situ polymerization method prepares PMDA / ODA class PI / A120A composite film: replace A105A with A120A, adopt and example 1 (2), (3) in identical operation, obtain PMDA / ODA class PI / A120A joint composite film , its electrical properties are shown in Figure 5.

Embodiment 3

[0077] (1) Modification of ceramic powder A2: replace A105, γ-(2,3 glycidoxy) propyltriethoxysilane (POTES, American Union Carbide) with A2 (A225) with an average particle size of 2.5.μm Company, model: A-187) instead of APTES, according to the same operation as in Example 1 (1), to obtain A2 (A225P) with POTES modification and an average particle size of 2.5 μm.

[0078] (2) Preparation of BTDA / ODA-like PI / A225P composite film by in-situ polymerization: replace A105A with A225P, and use 3,3',4,4'-benzophenone tetraacid dianhydride (BTDA, Beijing Gas Coal Chemical Research Institute ) instead of PMDA, the same operation as in Example 1 (2) and (3) was used to obtain BTDA / ODA-like PI / A225P composite film, the electrical properties of which are shown in Figure 6.

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Abstract

The present invention relates to organic / inorganic dielectric material and its preparation technology, and aims at one kind of high dielectric constant composite polyimide / ceramic film and its preparation process. The high dielectric constant composite polyimide / ceramic film has powdered ceramic dispersed homogeneously in polyimide matrix. The present invention also provides the preparation process of the composite film. The composite film of the present invention has high resistivity and low conductivity, and is suitable for use in capacitor and great power and great heat electronic and electric devices.

Description

technical field [0001] The technical field that the present invention relates to is organic / inorganic dielectric material and its preparation technology, especially relates to a kind of high dielectric constant polyimide / ceramic composite film and its preparation method. Background technique [0002] High dielectric constant materials are one of the core materials for electrical and electronic devices and products. [0003] With the advancement of science and technology, electrical and electronic devices and products are developing in the direction of miniaturization and low energy consumption. In high-power capacitors in high-performance power devices, flexible high-dielectric constant films that are easy to process in large areas are required; in printed circuit boards, it is necessary to realize overall packaging by using embedded high-capacity film capacitors, reduce the size of the circuit, Improve integration; at the same time, the demand for high dielectric constant ...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08J5/18C08K5/5419
Inventor 朱宝库徐志康
Owner ZHEJIANG UNIV
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