Electroconductive resin composition and electronic parts using the same
A conductive resin and electronic component technology, applied in the field of conductive resin composition, can solve the problems of reduced reliability of moisture resistance, easy ionization, electrode short circuit, etc. of electronic components
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Synthetic example 1
[0127] Under nitrogen, 100 g (0.24 moles) of BAPP (2,2-bis[4-(4-aminophenoxy)phenyl]propane) as a diamine was dissolved in a thermometer, a stirrer, a nitrogen introduction pipe and a cooling pipe. 400 g of N-methyl-2-pyrrolidone in a 1-liter four-neck flask. After cooling the obtained solution to -10°C, 49.5 g (0.24 moles) of isophthalic acid dichloride and 56.6 g of propylene oxide were added at a temperature not higher than -5°C. After stirring at room temperature for 3 hours, the reaction liquid was put into pure water to isolate the polymer, and after drying, it was dissolved in N-methyl-2-pyrrolidone, and then the resulting solution was put into pure water to refine the polyamide polymer. .
Synthetic example 2
[0129]Under nitrogen, 205 g (500 mmol) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane) as diamine was dissolved in a container equipped with a thermometer, a stirrer, a nitrogen introduction pipe, and a cooling pipe. 11177g of diethylene glycol dimethyl ether in a 3-liter four-necked flask. After cooling the obtained solution to -10°C, 105.3 g of trimellitic anhydride monochloride and 87 g of propylene oxide were added so that the solution temperature did not exceed -5°C. After stirring at room temperature for 3 hours, the viscosity of the reaction liquid was increased to form a transparent liquid, and then 841 g of diethylene glycol dimethyl ether was added, followed by further stirring for 1 hour. Thereafter, 128 g of acetic anhydride and 64 g of pyridine were added, and stirring was continued at 60° C. for a whole day and night. The resulting reaction solution was put into 250 g of methanol to isolate the polyamideimide, and after drying, it was dissolved in N,N-dimethylforma...
Embodiment K1
[0144] According to the ratio shown in Table 1, add the silver-plated copper powder and silver powder (SF#7 scale-like average particle size manufactured by Dekusa Co., Ltd., 6.8 μm) obtained in the production example of the above-mentioned silver-plated copper powder (a1) to the above-mentioned thermoplastic resin (B1 ) in the synthesis example obtained by adding 22.2 parts by weight of the polyamide polymer obtained by adding 222.2 parts by weight of diethylene glycol dimethyl ether to the varnish obtained by dissolving, and dispersing for 20 minutes by a disperser to obtain a composition (paste) K. After defoaming the obtained paste, apply a certain amount on a glass slide by screen printing (coating area: 1cm×7.5cm, coating thickness: 40±10μm), and then dry it at 180°C in a batch drying oven 1 hour to dry the coating film. The volume resistivity and migration characteristics of the obtained dried coating film were measured. Tantalum capacitors were fabricated using the ob...
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle size | aaaaa | aaaaa |
| particle diameter | aaaaa | aaaaa |
| particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More