Hybrid integrated silicon-based photosignal processing chip

Abstract

The invention discloses a photoelectric signal disposal chip of compound integral silicon base, which comprises the following parts: insulating silicon slice, optical wave leading in-to-out port, optical waveguide as optical transmission carrier, optical diving-to-combining element, semiconductor laser and receiver, wherein the optical diving-to-combining element, laser and receiver are assembled on the insulating silicon base plane at negative aligning surface placing pattern; the optical wave leading in-to-out port couples the compound end of optical diving-to-combining element; two different wavelengths optical signals pass optical waveguide and the same port; the separating end of optical diving-to-combining element connects two bifurcated optical waveguides with one bifurcated optical waveguide coupling laser to transmit output wavelength light and other bifurcated optical waveguide coupling receiver to transmit optical signal of input length.

Description

technical field [0001] The invention relates to an optoelectronic device, in particular to a hybrid integrated silicon-based photoelectric signal processing chip. Background technique [0002] An integrated optical network uses optical fiber to transmit voice, image and digital signals to users. The passive optical network (PON), which is currently promising in application trends, can transmit voice, image and data signals at the same time, which is what people often call triple play. (Triple Play Service). Passive optical splitters or combiners allow multiple optical network terminals to share the same optical fiber line. Each optical network terminal is located at a residential or commercial user end. For a typical fiber-to-the-home (FTTP) application, triple play One (Triple Play) signal service is transmitted on the network with three optical wavelengths: 1550nm downlink image signal, 1490nm downlink digital sound and digital signal, and 1310nm uplink digitized sound an...

AI Technical Summary

Problems solved by technology

[0005] 1) Due to the high requirements of the device on passive wave splitting / combining filter, laser, detector and device packaging shell, such as isolation, PDL and other technical indicators are quite high, the assembly process requirements are also becomes very high, resulting in relatively expensive

[0006] 2) After the passive splitter / combiner filter, laser, and detector are integrated together, crosstalk will occur due to uplink and downlink signals, and these crosstalk will also have a serious impact on the final performance of the device

[0007] 3) The laser and the detector must be coupled with an optical fiber at the same time, and the devices will interfere with each other, resulting in a decrease in indicators and yield

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