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Resin composition, cured composition and printed circuit board using same

A resin composition and the technology of the composition are applied in the secondary treatment of printed circuits, photosensitive materials for opto-mechanical equipment, photoengraving of patterned surfaces, etc. problems such as poor surface curing and deep curing, high photopolymerization ability, and excellent thermal stability are achieved.

Active Publication Date: 2010-05-12
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although these technologies can indeed achieve sufficient photopolymerization ability even with a single wavelength of light such as 405nm, they cannot obtain deep curability and surface curability at the same time, and there is a photopolymerization initiator on the circuit after heat treatment. Significant reduction in sensitivity due to deactivation, and problems with peeling on copper circuits
[0007] In addition, there are the following problems in the direct drawing and imaging with laser: since it is usually carried out in the air atmosphere, it is easy to cause reaction inhibition caused by oxygen, and in the development process of removing unnecessary parts after exposure, the corrosion resist as the necessary part The surface part of the coating is removed, and as a result, it is easy to cause poor gloss. Furthermore, in the solder resist film for the purpose of protecting the printed circuit board, the poor gloss is not only a problem of poor appearance, because it should react The part of the coating film is not fully reacted, which causes the problem that the chemical resistance of the surface of the coating film is poor, and the electrical characteristics are also deteriorated.

Method used

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  • Resin composition, cured composition and printed circuit board using same
  • Resin composition, cured composition and printed circuit board using same
  • Resin composition, cured composition and printed circuit board using same

Examples

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Embodiment

[0103] Hereinafter, the present invention will be specifically described by giving examples and comparative examples, but it should be understood that the present invention is not limited to the following examples.

Synthetic example 1

[0105] In a 2-liter detachable flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen inlet tube, a cresol novolak-type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EOCN-104S, 660 g of softening point (92 degreeC, epoxy equivalent=220g / equivalent), 421.3 g of carbitol acetate, and 180.6 g of solvent naphthas were heated to 90 degreeC, stirred, and dissolved. Next, it was once cooled to 60° C., 216 g of acrylic acid, 4.0 g of triphenylphosphine, and 1.3 g of methylhydroquinone were added, and reacted at 100° C. for 12 hours to obtain a reaction product having an acid value of 0.2 mg KOH / g. 241.7 g of tetrahydrophthalic anhydride was added there, and it heated at 90 degreeC, and it was made to react for 6 hours. Thus, the content of non-volatile content = 65% by weight, solid content acid value = 77 mg KOH / g, double bond equivalent (g weight of resin per 1 mole of unsaturated group) = 400 g / equivalent, weight average molecula...

Synthetic example 2

[0107] Add o-cresol novolac type epoxy resin (epoxy equivalent=215g / equivalent, average 1 molecule) in the 2 liters of detachable flask that has stirrer, thermometer, reflux condenser, dropping funnel and nitrogen inlet tube has 6 phenol cores) 430 g and acrylic acid 144 g (2 moles). The mixture was heated to 120°C while stirring, and the reaction was continued for 10 hours while maintaining the temperature at 120°C. The reaction product was once cooled to room temperature, 190 g (1.9 mol) of succinic anhydride was added, and the mixture was heated to 80° C. and reacted for 4 hours. Again, the reaction product was cooled to room temperature. The acid value of the solid content of this product was 139 mg KOH / g.

[0108] 85.2 g (0.6 mol) of glycidyl methacrylate and 45.9 g of propylene glycol methyl ether acetate were added to this solution, it heated to 110 degreeC, stirring, and continued reaction for 6 hours in the state maintained at 110 degreeC. The reaction product was ...

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Abstract

The present invention provides a resin composition, cured composition and printed circuit board using the same. Further, the present invention provides a light-settability or light-settability and heat-settability resin composition with excellent heat stability which is capable of exerting high light polymerization power with respect to laser of 400~420 nm and obtaining sufficient surface settability and deep part settability. The resin composition of the present invention is a composition capable of developing by diluent alkaline solution and comprising (A)resin containing carboxylic acid, (B)oxime ester light polymerization initiator containing oxime ester group of the formula (I); (C)aminoacetophenone light polymerization initiator containing the structure of formula(II); (D)compound containing more than one olefin unsaturated groups in the molecule; and(E) blue pigment, wherein the absorbance of the coating film, under the wave length of 400~420nm, is 0.5~1.2 for each 25 um.

Description

technical field [0001] The present invention relates to a photo-curable or photo-curable / thermo-curable material useful as an anti-corrosion coating or a solder resist film used in the manufacture of printed circuit boards, and as an insulating resin layer of various electronic components. The resin composition, its cured product and the printed circuit board made by using it. In further detail, the present invention relates to a photocurable or photocurable resin composition that can be cured by a blue-violet laser oscillation light source with a maximum wavelength of 400-420nm. A thermosetting resin composition, its cured product, and a printed circuit board made using it. Background technique [0002] Conventionally, a solder resist is formed on the outermost layer of the printed circuit board. The term "solder resist" refers to a protective coating material that covers the surface of a printed circuit board and prevents unnecessary solder from adhering to the circuit su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L101/08C08K5/33G03F7/028G03F7/11H05K3/28
CPCG03F7/0045G03F7/027G03F7/028
Inventor 柴崎阳子有马圣夫
Owner TAIYO INK MFG