High-heat-conductance electronic packaging material and its preparing method

Abstract

The invention relates to high thermal conduction electronic package material. Its components are as follows filling powder 10-80%, epoxy resin 5-30%, curing agent 10-65%, curing accelerating agent 0.1-2.5%, release agent 0.5-3%, colorant 0.5-3%, and proper flame retardant and thixotropic agent. The filling powder can be beta phase silicon nitride powder, or the mixture of the beta phase silicon nitride powder and the silicon dioxide whose adding proportion is 5-95% of the filling total weight. The invention uses beta phase silicon nitride powder as the filling to increase material electrical thermal, property, and mechanical properties, optimize filling powder size distribution to increase package material thermal conductivity and high temperature fluidity, mixes the beta phase silicon nitride powder and silicon dioxide to use as filling to make the package material thermal conductivity and expansion coefficient controllable, and greatly shorten industrialization production transformation period.

Description

technical field [0001] The invention relates to a new type of high thermal conductivity ceramic powder-β-phase silicon nitride powder applied to electronic packaging materials (electronic molding materials) fillers, and proposes a high-heat ceramic powder using β-phase silicon nitride powder as a filler. The invention relates to a preparation method of a conductive electronic packaging material (electronic molding compound), belonging to the technical field of electronic packaging materials. Background technique [0002] In recent years, with the rapid development of the current electronic information industry, electronic components are developing in the direction of miniaturization, high power and high integration, resulting in higher and higher heat generated per unit volume of integrated circuits, thus increasing the requirements for packaging materials. The higher the higher, the new high thermal conductivity electronic packaging material has become a hot spot of widespr...

AI Technical Summary

Problems solved by technology

Usually, ceramic powder with high thermal conductivity is added to epoxy resin to improve its thermal conductivity. At present, the fillers widely used mainly involve oxide ceramic powder, including Al 2 o 3 , SiO 2 etc., while the thermal conductivity of oxide ceramic powder is generally low, Al 2 o 3 The intrinsic thermal conductivity is 20W / m·K, SiO 2 The intrinsic thermal conductivity is only 14W / m·K, and the heat dissipation performance of the prepared packaging material can no longer meet the actual requirements.

In addition, SiO 2 Fillers also face the bottleneck of incompatibility in thermal conductivity and thermal expansion coefficient:

[0004] 1. Crystalline SiO 2 The thermal expansion rate is 15ppm / °C. After compounding with epoxy resin (30-50ppm / °C), it does not match with silicon (3.5ppm / °C), causing thermal stress inside the device

[0005] 2. Amorphous SiO 2 The thermal expansion rate is 1.3ppm / ℃, which is close to the thermal expansion coefficient of silicon, but the thermal conductivity is only 1.3W / m·K, which is not conducive to heat dissipation

However, the price of boron nitride and aluminum nitride ceramic powder is relatively high, resulting in low cost performance. In addition, the particle size of boron nitride powder is too small, so it is difficult to increase its addition ratio, which directly limits their large-scale industrial application.

[0007] Because the thermal conductivity of silicon nitride powder after sintering is only 23W / m.K, and the price of α-phase silicon nitride powder is relatively high, silicon nitride powder has not been used as an electronic packaging material (electronic molding compound) filler used