Anisotropic conductive film and manufacturing method thereof

An anisotropic and manufacturing method technology, applied in cable/conductor manufacturing, conductive connection, conductive adhesive and other directions, can solve the problems of lack of mass production of long objects, increased manufacturing cost, no disclosure, etc., and achieve easy mass production. The effect of production, cheap manufacturing, simple and manufactured

Inactive Publication Date: 2007-03-28
SUMITOMO RIKO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this ACF, since many minute penetrating holes are provided in the film thickness direction, it is necessary to use X-rays, SR (synchronous radiation), etc.
Therefore, there are problems in that the manufacturing cost is increased and the mass productivity of elongated objects is also lacking.
[0016] In addition, Non-Patent Document 2 and Non-Patent Document 3 describe that a porous membrane composed of a polymer having a honeycomb structure in which pores are regularly arranged in the film thickness direction is used as a substrate for culturing cells etc., but in terms of the material used for the anisotropic conductive film, there is no disclosure at all, and there is no mention

Method used

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  • Anisotropic conductive film and manufacturing method thereof
  • Anisotropic conductive film and manufacturing method thereof
  • Anisotropic conductive film and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0142] To a solution of polysulfone (manufactured by Aldrichichi, molecular weight Mw=56,000) dissolved in chloroform at a concentration of 0.1 [wt%], 10 [wt%] of dodecyl acrylamide and hexanoic acid were added to the polysulfone. As an amphiphilic substance, the copolymer is formulated into a polymer solution.

[0143] Then, the polymer solution was cast to a coating film thickness of 780 [μm] on a shallow pan (φ90 [mm]) continuously sprayed with air at a relative humidity of 50%, and the chloroform was volatilized. As a result, as shown in FIG. 6 , a porous membrane made of polysulfone was obtained which had many pores penetrating in the film thickness direction, the pores were arranged in a honeycomb shape, and the inner walls of the pores were curved outward. In addition, the pore diameter of the pores of the porous membrane was about 5 μm.

[0144]Then, the above-mentioned porous membrane was immersed in an Ag ethanol dispersion solution having a concentration of 3 [wt%]...

Embodiment 2

[0148] Polysulfone was dissolved in chloroform at a concentration of 0.2 [wt%], and the coating film thickness was set to 1560 [μm]. In the same manner as in Example 1, the anisotropic conductive film of Example 2 was produced. membrane. The porous membrane made of polysulfone obtained when the anisotropic conductive membrane of Example 2 was produced, and the porous membrane filled with Ag particles in the pores are shown in FIGS. 8 and 9 , respectively. In addition, the pore diameter of the pores of the porous membrane was about 10 μm.

Embodiment 3

[0150] Instead of polysulfone, siloxane-modified polyimide (manufactured by Ube Industries, "R15") was dissolved in chloroform at a concentration of 0.1 [wt%]. The anisotropic conductive film of Example 3 was produced in the same manner as in Example 1 except that the speed was set at 7 [μm / sec]. The porous film made of siloxane-modified polyimide obtained when the anisotropic conductive film of Example 3 was produced, and the porous film filled with Ag particles in the pores are shown in FIGS. 10 and 11, respectively. . In addition, the pore diameter of the pores of the porous membrane was about 5 μm.

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Abstract

An anisotropic conductive film, which is applicable to a narrower pitch of an object to be connected, while maintaining connection reliability, is provided at a low cost compared with the conventional ones. A method for manufacturing such anisotropic conductive film is also provided. The anisotropic conductive film is provided with a porous film. The film has many hole parts which penetrate in the film thickness direction, being arranged in a honeycomb state with their inner wall surfaces bent in the external direction, and are formed of a polymer. The film is also provided with a conductive material applied in the holes of the porous film, and an adhesive layer covering the both sides of the porous film. The porous film is formed by a method wherein the polymer is melt in a volatile organic solvent which does not mix with water and a supporting board made by casting the polymer solution is permitted to exist under a high moisture condition.

Description

technical field [0001] The present invention relates to an anisotropic conductive film and a manufacturing method thereof, and more specifically, to an anisotropic conductive film suitable for use in connection of electronic parts and substrates having narrow conductor intervals, and the manufacturing thereof method. Background technique [0002] In recent years, along with improvements in performance and miniaturization of electronic equipment, there has been an increasing need to electrically connect a plurality of conductors arranged at narrow pitches. Such a necessity arises, for example, in the liquid crystal display (Liquid Crystal Display: LCD) field, where electrodes and TAB (Tape Automated Bonding) electrodes and When the electrodes of the liquid crystal panel are connected, and when the glass substrate of the liquid crystal panel is directly connected (Chip On Glass: COG) to the IC for driving, etc. [0003] In the above-mentioned connection, generally, an anisot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R11/01C09J7/02C09J9/02C09J201/00H01B5/16H01B13/00H01R43/00
Inventor 别所久美佐藤秀之佐藤明生下村政嗣田中贤薮浩
Owner SUMITOMO RIKO CO LTD
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