Cooling device for cooling components of the power electronics, said device comprising a micro heat exchanger
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- ROBERT BOSCH GMBH
- Publication Date
- 2003-09-25
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
[0001] The present invention relates to a cooling device, in particular for cooling of components of power electronics, using a coolant which flows through a micro heat exchanger having a good heat contact with the component.
[0002] Such a cooling device has been described in INT. J. Heat Mass Transfer, volume 37, No. 2, pages 321-332, 1994, by M. P. Bowers and I. Mudawar, under the title: "High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks."
[0003] Generally, components or modules of power electronics, such as pulse-controlled inverters for example, are presently predominantly cooled using solid heat sinks made of aluminum or copper. Heat is dissipated here via a liquid coolant which flows through bore holes in the heat sinks.
[0004] Alternative heat dissipation via boiling bath cooling is known for power electronics components. Heat is dissipated here by evaporation of an electrically non-conductive fluid, which has d...