Method for making a thin film having a metallic pattern layer

Abstract

A method for making a thin film having a metallic pattern layer includes covering a release layer on the surface of a thin film substrate to leave a blank area of a predetermined pattern in the release layer, covering a metal layer on the release layer and the blank area, covering the metal layer with an adhesive layer, adhering a substrate-based thin film to the adhesive layer, and removing the substrate-based thin film to remove the part of the metal layer outside said blank area and the release layer together with the adhesive layer and the substrate-based thin film from the thin film substrate so that a metallic pattern layer is left on the thin film substrate for RFID (radio frequency identification) system, antennas of wireless transmission system, flexible printed circuit boards or chip on film (chip on flex) applications.

Description

BACKGROUND OF THE INVENTION[0001](a) Field of the Invention[0002]The present invention relates to a thin film fabrication method and more particularly to a method for making a thin film having a metallic pattern layer, which avoids chemical solvent and reagent washing and chemical etching.[0003](b) Description of the Prior Art[0004]Metal transfer-printing film or metal thin film has been intensively used in RFID (radio frequency identification) systems, antennas of wireless transmission systems, flexible printed circuit boards or chips on film (chips on flex), A metal transfer-printing film or metal thin film for this purpose is applied to coat a specially patterned metal layer on the surface of a thin substrate by sputter deposition, vacuum deposition (vacuum evaporation coating) or electroplating technique. An RF (radio frequency) transceiver chip or another type of wireless transmission chip is electrically connected to the terminal of the metal transfer-printing film or metal th...

AI Technical Summary

Benefits of technology

[0006]The present invention has been accomplished under the circumstances in view. A main object of the present invention is to provide a method for making a thin film having a metallic pattern layer, which enables a metallic pattern layer to be formed on a thin film substrate without any chemical washing step, thereby achieving cost-saving and environmental protection.

[0008]Because the release layer that covers on the thin film substrate has a blank area of a predetermined pattern (such as lines, letters, symbols, numerals, and so on) in it, the metal layer is tightly joined to the blank area and the thin film substrate after the metal layer is applied. Therefore, when the substrate-based thin film is removed, the metal layer outside the blank area and the release layer will be removed together with the adhesive layer and the substrate-based thin film from the thin film substrate, leaving a metallic pattern layer on the surface of the thin film substrate. Because the invention does not need to wash the metal layer with an acidic solvent, alkaline solvent or any other chemical solvent or reagent, no further waste water treatment procedure is necessary. Therefore, the thin film fabrication method of the present invention is environmentally friendly and can effectively reduce the manufacturing cost.

Problems solved by technology

This fabrication method produces a big amount of harmful heavy metal waste fluid or waste chemical solvent that must be properly treated before being discharged into a river.

This heavy metal waste fluid or waste chemical solvent treatment procedure greatly increases the manufacturing cost of the metal transfer-printing film or metal thin film.

If the harmful heavy metal waste fluid or waste chemical solvent is directly discharged into a river without any treatment, it will cause a severe environmental pollution.

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