Method for making a thin film having a metallic pattern layer

Inactive Publication Date: 2011-04-07
SHEU VICTOR SHI YUEH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0008]Because the release layer that covers on the thin film substrate has a blank area of a predetermined pattern (such as lines, letters, symbols, numerals, and so on) in it, the metal layer is tightly joined to the blank area and the thin film substrate after the metal layer is applied. Therefore, when the substrate-based thin film is removed, the metal layer outside the blank area and the release layer will be removed together with the adhesive layer and the substr

Problems solved by technology

This fabrication method produces a big amount of harmful heavy metal waste fluid or waste chemical solvent that must be properly treated before being discharged into a river.
This heavy metal waste fluid or waste chemical solvent treatment procedure greatly i

Method used

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  • Method for making a thin film having a metallic pattern layer
  • Method for making a thin film having a metallic pattern layer
  • Method for making a thin film having a metallic pattern layer

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Example

[0022]Referring to FIGS. 1 and 2, a method for making a thin film having a metallic pattern layer in accordance with the present invention includes the following steps:[0023](1) Release layer covering: As shown in FIGS. 3 and 4, cover the surface of a thin film substrate 1 with a release layer 2 by means of spray-painting, coating or printing technique, leaving a blank area 21 of a predetermined pattern (such as lines, letters, symbols, numerals, and so on) in the release layer 2. The thin film substrate 1 can be a paper film, a plastic film or an induction plastic film made from a high molecular chemical reaction engineering material of thermosetting resin and / or thermoplastic resin, such as PU (polyurethane), UP (unsaturated polyester), PS (polystyrene) and other high molecular polymers. The release layer 2 is a transparent or a colored layer prepared from a hydrophilic or lipophilic resin material such as polyvinyl alcohol or polyvinyl acetate, etc.[0024](2) Metal layer covering:...

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Abstract

A method for making a thin film having a metallic pattern layer includes covering a release layer on the surface of a thin film substrate to leave a blank area of a predetermined pattern in the release layer, covering a metal layer on the release layer and the blank area, covering the metal layer with an adhesive layer, adhering a substrate-based thin film to the adhesive layer, and removing the substrate-based thin film to remove the part of the metal layer outside said blank area and the release layer together with the adhesive layer and the substrate-based thin film from the thin film substrate so that a metallic pattern layer is left on the thin film substrate for RFID (radio frequency identification) system, antennas of wireless transmission system, flexible printed circuit boards or chip on film (chip on flex) applications.

Description

BACKGROUND OF THE INVENTION[0001](a) Field of the Invention[0002]The present invention relates to a thin film fabrication method and more particularly to a method for making a thin film having a metallic pattern layer, which avoids chemical solvent and reagent washing and chemical etching.[0003](b) Description of the Prior Art[0004]Metal transfer-printing film or metal thin film has been intensively used in RFID (radio frequency identification) systems, antennas of wireless transmission systems, flexible printed circuit boards or chips on film (chips on flex), A metal transfer-printing film or metal thin film for this purpose is applied to coat a specially patterned metal layer on the surface of a thin substrate by sputter deposition, vacuum deposition (vacuum evaporation coating) or electroplating technique. An RF (radio frequency) transceiver chip or another type of wireless transmission chip is electrically connected to the terminal of the metal transfer-printing film or metal th...

Claims

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Application Information

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IPC IPC(8): B32B38/10B32B37/14
CPCB32B38/10B32B2037/243B32B2037/246B32B2037/268H05K2203/0264B32B2519/02H05K1/0393H05K1/165H05K3/048B32B2311/00
Inventor SHEU, VICTOR SHI-YUEH
Owner SHEU VICTOR SHI YUEH
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