Method for Manufacturing High-Purity Erbium, High-Purity Erbium, Sputtering Target Composed of High-Purity Erbium, and Metal Gate Film having High-Purity Erbium as Main Component
a technology of erbium and erbium, which is applied in the direction of vacuum evaporation coating, sputtering coating, coating, etc., can solve the problems of not many documents relating to practical methods of extracting erbium, limit in achieving high purification, and cannot be said that erbium attracted much attention, so as to achieve efficient and stably supply high-purity erbium, high vapor pressure, and difficult to be refined
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example 1
[0044]As the erbium raw material, crude erbium oxide (Er2O3) of 3 N was used. The impurities contained in this raw material are shown in Table 1.
[0045]Subsequently, the erbium raw material was mixed with yttrium (Y) as the reducing metal, and a vacuum distillation apparatus was used to thermally reduce the mixture in a vacuum at 1600° C. Pursuant to the progress of reduction of erbium oxide, erbium was distilled to improve the purity, and the erbium with improved purity was stored in a capacitor.
[0046]Distillation and thermal reduction reaction was as follows:
Er2O3 (solid)+2Y (solid)→2Er (gas) +3Y2O3 (solid)
[0047]10 kg of erbium was extracted from the erbium distillate stored in the capacitor, a CaO crucible was used to melt the extracted erbium in Ar atmosphere, and this was solidified into an ingot.
[0048]It was thereby possible to manufacture high-purity erbium in which the purity excluding rare-earth elements and gas components is 4 N or higher, oxygen content is 40 wtppm or less...
example 2
[0051]The same raw material as Example 1 was used to perform reduction. The entire process was performed as with Example 1 other than that La was used as the reductant.
[0052]It was thereby possible to manufacture high-purity erbium in which the purity excluding rare-earth elements and gas components is 4 N or higher, oxygen content is 60 wtppm or less, elements of alkali metals are respectively 1 wtppm or less, elements of transition metals are respectively 10 wtppm or less, and radioactive elements are respectively 10 wtppb or less. Although both Example 1 and Example 2 were able to achieve an oxygen content of 100 wtppm or less, in the case of Example 2, the content of radioactive elements U and Th was slightly high.
[0053]The sputtering target obtained from the foregoing ingot was also able to retain a high purity level, and it was possible to form a high-purity erbium thin film with uniform characteristics on a substrate by sputtering the foregoing sputtering target. The results ...
example 3
[0054]The entire process was performed as with Example 1 other than that erbium oxide of 3 N level was used as the raw material and the reduction / distillation temperature was set to 2500° C.
[0055]It was thereby possible to manufacture high-purity erbium in which the purity excluding rare-earth elements and gas components is 4 N or higher, oxygen content is 200 wtppm or less, elements of alkali metals are respectively 10 wtppm or less, elements of transition metals are respectively 100 wtppm or less, and radioactive elements are respectively 5 wtppb or less. In this Example, the impurity content was high overall since the reduction / distillation temperature was high, but it was still possible to keep it within an acceptable range.
[0056]The sputtering target obtained from the foregoing ingot was also able to retain a high purity level, and it was possible to form a high-purity erbium thin film with uniform characteristics on a substrate by sputtering the foregoing sputtering target. Th...
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