Gas barrier film and electronic device

Abstract

Disclosed is a gas barrier film, which demonstrates superior gas barrier properties and surface smoothness, demonstrates a high degree of adhesion between layers and is resistant to cracking when bent, and an electronic device provided therewith. A gas barrier film of the present invention has a base, and a polyorganosiloxane layer and an inorganic material layer sequentially provided on at least one side of the base, and the inorganic material layer is deposited by dynamic ion mixing method.

Description

[0001]This application is a 371 application of PCT / JP2010 / 001898, filed Mar. 17, 2010, which, in turn, claims priority of Japanese Patent Application No. 2009-083871, filed on Mar. 31, 2009.TECHNICAL FIELD[0002]The present invention relates to a gas barrier film and an electronic device provided with that gas barrier film.[0003]The present application claims priority on the basis of Japanese Patent Application No. 2009-083871 filed in Japan on Mar. 31, 2009, the contents of which are incorporated herein by reference.BACKGROUND ART[0004]Transparent resin films have been attempted to be used in recent years as an alternative to glass substrates in applications such as image display elements or solar cell modules accompanying requirements for increased flexibility, lighter weight and reduced thickness.[0005]FIG. 5 is a schematic cross-sectional view showing an example of a solar cell module in which a transparent resin film is used as a protective sheet.[0006]This solar cell module 200...

AI Technical Summary

Benefits of technology

[0031]According to the gas barrier film of the present invention, since surface irregularities in the surface of the base are filled in by a layer containing a polyorganosiloxane-based compound provided on the base, the shape of surface irregularities in the surface of the base are inhibited from standing out on the surface. Consequently, this gas barrier film allows the obtaining of high surface flatness.

[0032]In addition, as a result of providing the inorganic material layer on the layer containing a polyorganosiloxane-based compound and depositing the inorganic material layer by dynamic ion mixing method, the layer containing a polyorganosiloxane-based compound and the inorganic material layer are securely adhered, thereby inhibiting layer separation. When carrying out processing using the gas barrier film of the present invention, the gas barrier film can be applied to a processing apparatus having a small diameter roll, thereby facilitating handling.

[0033]In addition, since the inorganic material layer deposited by dynamic ion mixing method has few pinholes, superior gas barrier properties, and is resistant to the occurrence of cracking when the film is bent, the gas barrier properties thereof can be maintained over a long period of time. Moreover, since both the inorganic material layer and the layer containing a polyorganosiloxane-based compound have gas barrier properties, this gas barrier film allows the obtaining of extremely superior gas barrier properties.

[0034]In addition, according to the electronic device of the present invention, as a result of being provided with a gas barrier film as described above, gas such as water vapor which is present outside the electronic device is reliably prevented from entering inside the electronic device, thereby allowing the obtaining of superior weather resistance and durability. In addition, even in the case of having a process by which an electrode film is deposited on the surface of a gas barrier film, since the surface flatness of the gas barrier film is high, the formation of protrusions on the electrode film during the deposition process is prevented, thereby making it possible to avoid disconnections and short circuits attributable to the protrusions on the electrode film.

Problems solved by technology

However, transparent resin films have poor gas barrier properties in comparison with glass substrates, and are unable to adequately prevent entrance of water vapor into solar modules as is.

In addition, since transparent resin films have low surface flatness, when an electrode film is deposited on the surface thereof, protrusions that cause disconnections or short circuits are formed in the electrode film.

In addition, the inorganic thin film is subject to the occurrence of cracking when the gas barrier films are bent, thereby resulting in the risk of gas easily permeating the film at locations where cracking has occurred.

However, in addition the production process of this film being complex, adhesion between the inorganic thin film and organic thin film is low, thereby resulting in increased susceptibility to separation of the thin films.

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