Highly filled high thermal conductive material, method for manufacturing same, composition, coating liquid and molded article

a high-temperature conductive material and high-temperature technology, applied in the field of high-temperature conductive materials, can solve the problems of insufficient manifestation of the advantages of organic polymers, insufficient intrinsic properties of thermally conductive materials, and marked degradation of mechanical properties such as strength of molded articles, etc., to achieve high thermal conductivity, low thermal expansion coefficient, and high thermal conductivity

Inactive Publication Date: 2015-09-17
TAKAGI CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Organic polymers have excellent features that are not found in other materials; however, in composite materials thereof with thermally conductive materials (thermally conductive fillers and short carbon fibers), the thermally conductive materials cannot sufficiently exhibit inherent properties intrinsically, such as high thermal conductivity.
However, since the polymer does not sufficiently penetrate into the thermally conductive material, a sea-island structure in which a portion of the polymer phase forms islands is formed, and mechanical properties such as strength of a molded article are markedly deteriorated.
Even in this case, the advantages of organic polymers are not sufficiently manifested.

Method used

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  • Highly filled high thermal conductive material, method for manufacturing same, composition, coating liquid and molded article
  • Highly filled high thermal conductive material, method for manufacturing same, composition, coating liquid and molded article
  • Highly filled high thermal conductive material, method for manufacturing same, composition, coating liquid and molded article

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examples

[0165]Hereinafter, the present invention will be specifically explained by way of Examples, Comparative Examples and Reference Examples, but the scope of the present invention is not intended to be limited to these. Meanwhile, production and evaluation of raw materials and specimens were carried out as follows.

[0166](1) Raw Materials:

[0167][Organic Polymer Particles]

[0168]Polyphenylene sulfide (PPS) powder: W203A NATURAL manufactured by Kureha Corp., white powder, linear form, particle size 100 to 500 μm, melting point 296° C., heat of fusion 33 J / g, coefficient of thermal expansion 50×10−6° C.−1

[0169]Polyphenylene sulfide (PPS) pellet: FZ-2100BK manufactured by DIC Corp., black pellet, crosslinked type, shape: about 1.5 mm in inner diameter×about 2 mm in length, melting point 280° C., heat of fusion 28 J / g, coefficient of thermal expansion 40×10−6° C.−1

[0170]Polyethylene terephthalate (PET): waste PET bottle recycled product, white flakes, particle size 1 to 2 mm, melting point 2...

examples 8 to 13

[0211]High filler-loaded high thermal conductive materials were obtained at the compositions of Table 4 by the same method as that used in Example 1, by newly providing a polyethylene terephthalate (PET) powder and a polycarbonate (PC) powder (Examples 8 to 13).

[0212]The density, thermal conductivity, electrical conductivity, coefficient of linear expansion, bending strength, flexural modulus of elasticity, heat of fusion per resin, and heat of fusion per filler of the specimens (molded articles) thus obtained were measured by the same methods as described above. The results thus obtained are presented in Table 4.

[0213]Meanwhile, in regard to PC which is a non-crystalline aromatic resin, the heat of fusion of the raw material powder exhibited a high value such as 26 J / g resin, but the molded article did not exhibit an endotherm peak that represents the melting point. Thus, the molded article was annealed for 2 hours at 180° C. to 240° C., and an endotherm peak corresponding to the m...

examples 14 to 19

[0215]A low molecular weight polyethylene (PE) powder and benzoxazine were newly provided, and high filler-loaded high thermal conductive materials were obtained at the compositions of Table 5 by the same method as that used in Example 1 (Examples 14 to 19).

[0216]The density, thermal conductivity, electrical conductivity, coefficient of linear expansion, bending strength, flexural modulus of elasticity, heat of fusion per resin, and heat of fusion per filler of each of the specimens (molded articles) thus obtained were measured by the same methods as described above. The results thus obtained are presented in Table 5.

[0217]Meanwhile, benzoxazine, which is a thermosetting resin, is a precursor (oligomer) of polybenzoxazine. The heat of fusion of the raw material was 25 J / g, but an endotherm peak corresponding to the heat of fusion of a molded article using this raw material was not observed. It is contemplated that except for the peripheries of the thermally conductive filler particl...

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Abstract

[Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.[Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equal to the deflection temperature under load, melting point or glass transition temperature of the organic polymer and a pressure of 1 to 1000 kgf / cm2; and to cooling and solidification.

Description

TECHNICAL FIELD[0001]The present invention relates to a high filler-loaded high thermal conductive material, a method for producing the same, a composition, a coating liquid and a molded article.BACKGROUND ART[0002]Along with the performance enhancement, functional enhancement, miniaturization, and expansion of the range of applications of electronic equipment, the issue of heat associated with semiconductor elements such as CPU, driver elements, electronic transducers, thermoelectric conversion elements (Peltier cooling, Seebeck power generation) and light emitting elements (laser, LED, organic EL, and the like) used therein, lithium ion batteries, fuel cells, and the like that are used in the electronic equipment, has posed a significant problem. Thus, investigations have been conducted on the removal of this heat, from various aspects such as a material aspect and a structural aspect.[0003]Furthermore, also for automobiles, which are used under severe conditions for environmental...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09K5/14B32B27/20B32B27/08B32B27/28B32B27/36B32B7/025B32B7/027C09D7/61
CPCC09K5/14B32B27/286B32B27/36B32B27/08B32B2307/302B32B2250/02B32B2250/24B32B2262/106B32B27/20C08K3/04C08K3/38C09D201/00C08L101/00C09D5/24C08K7/06C08K7/14C08K2003/385C08K2201/005C09D7/61B32B5/022B32B5/16B32B5/24B32B5/30B32B7/04B32B2260/025B32B2260/046B32B2262/101B32B2262/103B32B2264/0207B32B2264/0214B32B2264/0221B32B2264/0235B32B2264/0242B32B2264/025B32B2264/0257B32B2264/0264B32B2264/0278B32B2264/101B32B2264/102B32B2264/104B32B2264/105B32B2264/107B32B2264/108B32B2264/12B32B2307/202B32B2307/304B32B2307/308B32B2307/54B32B2307/546B32B2307/58B32B2307/72B32B2307/734B32B2451/00B32B2457/08B32B2457/14B32B2457/18B32B2457/202B32B2264/0285Y10T428/31786B32B7/025B32B7/027C08L81/04C08L69/00C08L67/02C08L23/04C09D7/40
Inventor TAKAGI, NORIAKINAGATANI, YUUSUKETERAO, YUUTAMATSUYAMA, KAZUOTAKEICHI, TSUTOMUMATSUMOTO, AKIHIKO
Owner TAKAGI CHEM
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