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Copper foil and methods of use

a technology of copper foil and copper foil, applied in the direction of resistor details, resistors adapted for applying terminals, other domestic articles, etc., can solve the problem of easy peeling of nickel lead from copper foil, and achieve the effect of easy peeling and ensuring the stability of the ptc devi

Active Publication Date: 2017-07-20
CHANG CHUN PETROCHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The treated copper foil enhances the stability and assembly of PTC devices by maintaining high tensile strength and surface hardness, preventing delamination and ensuring reliable operation in electronic devices.

Problems solved by technology

If the opposed electrically conductive elements are formed of copper foil, the copper will migrate into the solder, changing the composition of the solder, causing the nickel lead to easily peel from the copper foil.

Method used

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  • Copper foil and methods of use
  • Copper foil and methods of use
  • Copper foil and methods of use

Examples

Experimental program
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Effect test

example 1

Manufacture of Electrolytic Copper Foil

[0045]Copper wires were dissolved in a 50 wt % sulfuric acid aqueous solution to prepare a copper sulfate electrolyte containing 320 g / l of copper sulfate (CuSO4.5H2O) and 100 g / l of sulfuric acid. To per liter of the copper sulfate electrolyte 0.35 mg of gelatin (DV: Nippi Company), and 2.0 mg chloride ion were added. Subsequently, an electrolytic copper foil with thickness of 35 μm is prepared at a liquid temperature of 55° C. and current density of 70 A / dm2.

Copper Nodule Treatment of the Matte Side of Electrolytic Copper Foil

[0046]Copper nodules were formed on the matte side of the copper foil utilizing the following materials and parameters of temperature, current density and time:

[0047]Copper Sulfate (CuSO4.5H2O): 120 g / l

[0048]Sulfuric Acid (H2SO4): 100 g / l

[0049]Chloride Ion: 3.5 ppm

[0050]Temperature: 25° C.

[0051]Current Density: 40 A / dm2

[0052]Time: 3.5 Sec

Smooth Nickel Plating Over the Matte Side of the Copper Foil and the Copper Nodules...

examples 2-6

[0093]Examples 2-6 were prepared in the same manner as Example 1.

[0094]The foregoing copper foils of Examples 2-6 were treated to form copper nodules on the matte side of the copper foil in the same manner as in Example 1.

[0095]Both the matte side and shiny side of the copper foil were then plated with a smooth layer of nickel in the same manner as in Example 1. The nickel content on the shiny side of the copper foil of Examples 1-6 resulted in a nickel content of within 10,000 to about 80,0000 μg / dm2. The nickel content on the matte side of the copper foil resulted in a nickel content of within about 100,000 to about 300,0000 μg / dm2 for each of the foregoing Examples.

[0096]The products of Examples 1-6 were measured and tested and the results are set forth in TABLE 1.

TABLE 1Example123456Thickness (μm)353535353535Tensile strength (kg / mm2)45.246.462.955.264.760.2Elongation (%)14.912.810.211.612.510.6S side Rz (μm)1.050.621.121.981.561.67M side Rz (μm)6.156.026.257.269.988.03Ni content...

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Abstract

A copper foil having a matte side with nickel plated thereon in an amount of nickel in the range of 100,000-300,000 μs / dm2. The plated copper foils have particular utility in Positive Temperature Coefficient (PTC) devices. The plated copper foils have a surface hardness of from 50 to 200, a tensile strength greater than 45 kg / mm2 and a shiny side surface roughness (Rz) not exceeding 2.0 μm. The surface roughness of the matte side of the copper foil is in the range of 6 to 10 μm. Copper nodules are present on the matte side of the copper foil between the copper foil and the nickel plating. Methods of producing the copper foil and PTC devices incorporating the copper foil are described.

Description

FIELD OF THE DISCLOSURE[0001]The present disclosure relates to an improved copper foil with copper nodules on the matte side of the copper foil. A smooth nickel plating is formed over both the shiny side, as well as the matte side and copper nodules of the copper foil. Nickel nodules are formed in direct contact with the nickel plating on the matte side of the copper foil. The foils of the instant disclosure are useful in making a Positive Temperature Coefficient (PTC) device. Such PTC devices can be used as a resettable fuse. Particular articles in which the PTC fuse is used includes batteries, computer, mobile telephone, AC power supplies, an AC / DC power adapter, automotive, portable digital assistant (PDA), portable multi-media player, MP3 player, game console, USB, HUB, medical equipment, industrial controls and other electrical and electronic devices and systems. Methods for manufacturing the copper foil; the PPTC devices; the resettable fuses; and the use of such in useful art...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B32B15/01H01C7/00B32B37/12B32B37/10B32B37/16
CPCB32B37/10B32B37/16B32B37/1284B32B15/01B32B2311/12B32B2311/22B32B2457/00H01C7/008C25D5/14H01C7/021H01H85/06C25D1/04C25D3/12C25D3/38C25D7/0621H01C1/1406H01C7/027H01C17/28H05K1/09H05K2201/0355C25D7/0614H05K2203/0307C25D5/605C25D5/611C25D5/627C25D7/0628
Inventor CHENG, KUEI-SENTSENG, SHIH-CHENGJUO, TSANG-JIN
Owner CHANG CHUN PETROCHEMICAL CO LTD