Method of manufacturing hexagonal boron nitride laminates

Inactive Publication Date: 2017-08-24
ZHANG JINGYU +3
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  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0006]Another objective of the present invention is to provide a method of manufacturing hexagonal boron nitride laminates in which a thermal condu

Problems solved by technology

Unfortunately, most of the economically viable insulating materials are characterized by low thermal conductivity, which seriously limits their application as effici

Method used

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  • Method of manufacturing hexagonal boron nitride laminates
  • Method of manufacturing hexagonal boron nitride laminates
  • Method of manufacturing hexagonal boron nitride laminates

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Embodiment Construction

[0018]A method of manufacturing hexagonal boron nitride laminates according to a preferred embodiment of the present invention contains steps of:

[0019]a) Dissolving 10 to 80 wt % dielectric polymers in solvent.

[0020]Preferably, the dielectric polymer is at-least one of the following polymers, including polyethylene terephthalate (PETP), polyphenylene sulfide (PPS), polyetherimide (PEI), polyetherether ketone (PEEK), polyetherketone (PEK), polyimide (PI), Polyvinylidene fluoride (PVDF), phenol resin or acrylic resins.

[0021]b) Mixing 20 to 90 wt % h-BN powder to form a well-mixed h-BN coating slurry.

[0022]Preferably, the thickness of h-BN powders ranges from 1 to 500 nm, and the size is from 0.1 to 100 μm.

[0023]c) Coating slurry on substrates and dried at 100 to 150° C. A layer of h-BN laminates was obtained after this process.

[0024]d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process.

[0025]d-2) For h-BN film on...

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Abstract

A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W/m·K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a method of manufacturing hexagonal boron nitride laminates which exhibits thermal conductivity of hexagonal boron nitride laminates 10 to 40 W / m·K, which is significantly larger than that currently used in thermal management.BACKGROUND OF THE INVENTION[0002]Increasing circuit density and miniaturization of the modem electronics make the highly efficient heat removal and dissipation ever more critical for reliable operation of the electronic devices and systems. Hence the industry is in an urgent need of novel thermally conductive materials suitable for various thermal management applications. It is especially beneficial if such materials are electrically insulating since it would make it possible to apply them directly on the electronic circuitry. Unfortunately, most of the economically viable insulating materials are characterized by low thermal conductivity, which seriously limits their application as efficient heat spr...

Claims

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Application Information

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IPC IPC(8): B29C41/24B05D3/12
CPCB29C41/24B05D3/12B29K2105/16B29L2007/008B29K2995/0006B29K2995/0013B29K2509/00C01B21/064H01L21/4807H05K1/00
Inventor ZHANG, JINGYUCHANG, KUO-HSINCHEN, JIA-CINGLAI, CHUNG-PING
Owner ZHANG JINGYU
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