Method of manufacturing hexagonal boron nitride laminates

Abstract

A method of manufacturing hexagonal boron nitride laminates contains steps of: a) Dissolving dielectric polymers in solvent. b) Mixing h-BN powder to form a well-mixed h-BN coating slurry. c) Coating slurry on substrates and dried at 100 to 150° C. d-1) For free standing h-BN film, peel off h-BN dielectric polymer layer from substrate in water batch by roll to roll process. d-2) For h-BN film on substrates, heat compression of the substrates and hBN laminates at 100 to 250° C. for multi-layer structures. Thereby, hexagonal boron nitride laminates exhibit thermal conductivity of 10 to 40 W / m·K, which is significantly larger than that currently used in thermal management. In addition, thermal conductivity of hexagonal boron nitride laminates increases with the increasing mass density, which opens a way of fine tuning of its thermal properties.

Description

FIELD OF THE INVENTION

[0001] The present invention relates to a method of manufacturing hexagonal boron nitride laminates which exhibits thermal conductivity of hexagonal boron nitride laminates 10 to 40 W / m·K, which is significantly larger than that currently used in thermal management.BACKGROUND OF THE INVENTION

[0002] Increasing circuit density and miniaturization of the modem electronics make the highly efficient heat removal and dissipation ever more critical for reliable operation of the electronic devices and systems. Hence the industry is in an urgent need of novel thermally conductive materials suitable for various thermal management applications. It is especially beneficial if such materials are electrically insulating since it would make it possible to apply them directly on the electronic circuitry. Unfortunately, most of the economically viable insulating materials are characterized by low thermal conductivity, which seriously limits their application as efficient heat spr...

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