An audio monitor/microphone combination coupled to a four contact plug connector is provided. Exemplary audio monitors include ear buds, in ear monitors, over-the-head headsets, over-the-ear headsets, clip-on headsets, and behind-the-neck headsets. Exemplary microphones include boom-mounted microphones, earphone integrated microphones, microphones located on (or integrated within) the headset cable, and lanyard mounted microphones. The plug connector is configured such that the tip contact region corresponds to the left-hand speaker channel input, the second contact region adjacent to the tip contact region corresponds to the right-hand speaker channel input, the third contact region adjacent to the second contact region corresponds to the microphone output, and the fourth contact region adjacent to the third contact region corresponds to both the speaker ground and the microphone ground. Insulating rings are interposed between each pair of contact regions. Preferably an adaptor is included with the audio monitor/microphone combination as part of an accessory kit.