Method for developing aluminum nitride crystal in large size through flow of plasma flame

A technology of plasma and aluminum nitride single crystal, which is applied in the field of preparation of high temperature semiconductor single crystal materials, can solve the problems of difficult control of crystal growth rate, difficulty in precise measurement and control, and crucible damage, so as to avoid the selection and use of crucible materials. life, improve crystal growth rate, and ensure the effect of crystal quality

Inactive Publication Date: 2008-11-19
SHENZHEN UNIV
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Problems solved by technology

Not to mention that this kind of laboratory-level research results cannot yet achieve industrial production, nor can it meet the quantitative needs of aluminum nitride crystals in various application fields.
The fundamental reason for the above difficulties is that the sublimation crystallization method of aluminum nitride crystals has certain limitations in principle. The specific performance is as follows: ①The sublimation crystallization method uses a material closed or semi-closed system, which is difficult to realize during the growth process. The crystals cannot continue to grow due to the continuous transportation of materials; ② After the raw materials in the system experience several temperature fluctuation cycles, the raw materials will lose their activity, resulting in powder agglomeration, and the sublimation rate of the whole system becomes smaller; ③ Crystal growth rate Difficult to control, especially early in crystal growth
In principle, the crystal growth rate can be controlled by adjusting the temperature and temperature gradient of the sublimation zone and crystallization zone of the growth chamber, but in practice, it is difficult to accurately measure and control the temperature in the high temperature zone; ④ sublimation method Aluminum nitride crystal growth requires a crucible, but the aluminum vapor generated by decomposition at high temperature will severely damage the crucible

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  • Method for developing aluminum nitride crystal in large size through flow of plasma flame

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Embodiment 1

[0011] use figure 1 The schematic experimental setup is shown for the growth of AlN single crystals. The principle device includes a shell 1 made of metal materials such as stainless steel, and is equipped with a DC arc plasma flame flow device 2, a raw material powder feeding rate control device 3, a sample stage 4 with lifting and rotating functions, a vacuum device and Pressure control system 5, and seed crystal holder and substrate support table 6. The power supply, gas supply system and carrier gas supply system of the plasma plume equipment are not shown in the schematic diagram.

[0012]The DC arc plasma flame 2 is used as the heat source for heating raw materials during the crystal growth process, high-purity aluminum powder is used as the source material of aluminum atoms, the seed crystal is selected from aluminum nitride single crystal grown by other methods, and nitrogen is used as the protective gas in the growth chamber. Before crystal growth, the reaction cham...

Embodiment 2

[0014] This embodiment also uses figure 1 The schematic experimental setup is shown for the growth of AlN single crystals. The DC arc plasma flame 2 is used as the heat source for heating raw materials during the crystal growth process, the aluminum nitride micropowder with appropriate particle size is used as the source material of aluminum atoms, the seed crystal is selected from aluminum nitride single crystal grown by other methods, and nitrogen gas is used in the growth chamber as the source material. Protective gas. Before crystal growth, the reaction chamber is evacuated to remove oxygen and other impurity gases, and then filled with nitrogen. During the growth process, the pressure in the growth chamber is maintained near an appropriate value by the pressure control system 5 . When the aluminum nitride crystal growth starts, the plasma flame flow is first turned on, and the parameters of the plasma are adjusted to the appropriate parameters for the growth of the alum...

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Abstract

This invention discloses a method for growing AlN single crystal by heating raw materials with plasma flow. The method comprises: utilizing plasma flow as the heating source, and AlN micropowder or high-purity Al micropowder and N2 as the raw materials, sending the raw materials into plasma flow by using carrier gas, utilizing AlN single crystal as the crystal seed or AlN polycrystal as the matrix material for self-nucleating growth, heating the crystal seed or matrix material by plasma flow or other methods to the temperature need for crystallization, and growing in the growth chamber with N2 as the growth environmental gas. The powder delivery rate is adjustable. The stage for supporting the crystal seed or matrix material can be elevated and rotated with controllable speed. The pressure of N2 is adjustable. This invention also shows the figure for depicting the reaction apparatus for growing AlN single crystal by heating raw materials with plasma flow.

Description

technical field [0001] The invention relates to the preparation of high-temperature semiconductor single crystal materials used in the electronics and optoelectronic industries, especially the preparation method of growing aluminum nitride crystal materials. Aluminum nitride crystal materials are used in all solid-state white light lighting, sterilization and disinfection devices, compact analytical equipment used in biotechnology and pharmaceuticals, biological agent detection systems, compact ultraviolet light sources in covert communications, and short-wavelength lasers used in high-density data storage And many other fields have broad application prospects, in addition, it is also very promising as a substrate material for making nitride semiconductor devices, high-power radio frequency devices, millimeter wave devices and microwave devices. Background technique [0002] International research on aluminum nitride single crystal growth technology can be traced back to the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B23/08C30B25/02C30B29/38
Inventor 敬守勇郑瑞生刘文段子刚
Owner SHENZHEN UNIV
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