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Method of producing sheet shaped silver-plated copper powder

A technology of silver-plated copper powder and copper powder, which is applied in the direction of coating, etc., can solve the problems of copper powder oxidation and affect the conductivity of copper powder, and achieve the effect of low silver content, good conductivity and cost reduction

Inactive Publication Date: 2009-06-03
SHENZHEN SHENTOU ENVIRONMENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because ball milling copper powder will cause oxidation of copper powder under the condition of not being isolated from air, ball milling will also cause copper oxide particles to enter the interior of copper powder, thus affecting the conductivity of copper powder

Method used

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  • Method of producing sheet shaped silver-plated copper powder

Examples

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Comparison scheme
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Embodiment Construction

[0024] The following examples are further explanations and descriptions of the present invention, and do not constitute any limitation to the present invention.

[0025] Take 220 liters of acidic copper-containing etching waste liquid (copper concentration 100 g / liter), add ammonia to PH1, add water to 500 liters, add 5 kg of ammonia chloride, heat to 80°C, slowly add 6.4 kg of aluminum chips, and stir for 1 hour , The reaction to obtain amorphous copper powder, deionized water centrifugation to wash the copper powder for later use.

[0026] Take 1 kilogram of copper powder in a 5 liter vacuum ball milling tank, add 5000 grams of stainless steel balls, 10 grams of polyoxyethylene ether glycol ester, 10 grams of polyethylene glycol, 20 grams of potassium citrate, 400 milliliters of water, and 20 grams of sodium sulfite. The tank is evacuated and milled with a planetary ball mill at 1000 rpm for 24 hours to obtain flake copper powder.

[0027]Take 1 kg of flake copper powder in a 20...

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Abstract

The process of preparing flaky silver plated copper powder includes the following steps: 1. adding ammonia water and ammonium chloride to waste copper etching liquid through stirring at 50-100 deg.c, adding aluminum chips to reduce and obtain amorphous copper powder, washing and centrifugally drying to obtain clean copper powder; 2. vacuum ball milling the copper powder in a ball mill with steel balls for 10-60 hr after adding lubricant, solder resistant, complexing agent and deoxidant, separating, washing and centrifugally drying to obtain flaky copper powder; and 3. adding flaky copper powder into water solution of silver nitrate with wetting dispersant, complexing agent and reductant to react and to obtain flaky silver plated copper powder, washing with distilled water and organic solvent, and vacuum drying to obtain the product.

Description

【Technical Field】 [0001] The invention relates to a recycling technology of metallic copper contained in etching waste liquid in the printed circuit board industry, and particularly relates to a preparation method of sheet-shaped silver-plated copper powder. 【Background technique】 [0002] At present, the printed circuit board industry produces a large amount of copper-containing etching waste in the process of etching and processing printed circuit boards. The Pearl River Delta region alone produces more than 200,000 tons of copper-containing etching waste every year. Since the copper-containing etching waste liquid contains a high concentration (approximately 5%-15%) of copper ions, if it is not treated, it will form a serious hidden danger of water environment pollution, which is a national hazardous waste. [0003] The existing recycling method of copper-containing etching waste liquid is to manufacture copper sulfate, basic copper carbonate, basic copper chloride and other c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02B22F9/04B22F9/24
Inventor 陈昌铭温炎燊陈志传王卫红
Owner SHENZHEN SHENTOU ENVIRONMENT TECH CO LTD