Wire cutting liquid of semiconductor material

Abstract

The invention relates to a wire cutting fluid for semiconductor materials. Its composition and weight % ratio are as follows: polyethylene glycol 10-10000: 35-90, amine base: 8-30, penetrating agent: 1-5, ether alcohols Active agent: 0.5-5, chelating agent: 0.5-5, deionized water: 0-55. The advantages of the present invention are: 1. The existing neutral or acidic wire cutting fluid is improved into an alkaline wire cutting fluid having a chemical interaction with silicon, which can avoid acid corrosion of equipment and reduce wire saw wire breakage rate. 2. It effectively solves the problem of re-deposition of chips and diced powder, avoids the phenomenon of chemical bonding and adsorption on the surface of silicon wafers, and facilitates the cleaning and subsequent processing of silicon wafers. 3. The effects of penetration, lubrication and cooling are remarkable, and the surface damage, mechanical stress, thermal stress and pollution of metal ions to silicon wafers of the obtained slices are significantly reduced. 4. The cost price is low, which is beneficial to replace the imported wire cutting fluid.

Description

technical field [0001] The invention belongs to cutting fluid, in particular to a wire cutting fluid for semiconductor materials. Background technique [0002] During the ingot slicing process, due to the strong mechanical force, the edge of the silicon wafer is prone to microcracks, chipping and stress concentration points, and the surface of the silicon wafer also has uneven stress distribution and damage. These defects are the cause of a large number of IC manufacturing. Slip lines, epitaxial stacking faults, slip dislocations, micro-defects and other secondary defects are important factors for the cracking of silicon wafers and chips. [0003] In recent years, the silicon single crystal substrate wire cutting process, which has been developing strongly in recent years, has shown its huge advantages compared with the inner diameter cutting process in many aspects such as the depth of damage on the surface of the silicon wafer, the consistency of the surface structure, and...

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the technical problem that the known wire cutting fluid has unsatisfactory effects in overcoming the surface damage, mechanical stress and thermal stress of the silicon wafer in the wire cutting process, and discloses a chemically effective, easy to clean, good heat dissipation effect, It has good penetration and lubricating effect, can significantly reduce the depth and stress of the damaged layer on the surface of silicon wafers, and is a cheap wire cutting fluid for semiconductor materials