An organic luminescence part

Abstract

The invention relates to a organic luminophor that includes base plate, anode layer, lightening layer, cathode layer and encapsulation plate which is used in encapsulation, it characterized in that said encapsulation plate possesses low melting point metal structure and function of radiating, said low melting point metal is embedded in cavity of said encapsulation plate, and encapsulated to inner of encapsulation plate by ultraviolet radiation solidify glue, the heat conduction material which possesses function of heat conduction is filled to the space between the cathode layer and the encapsulation plate, the invention, the craft of organic luminophor is simple, and the invention possesses perfect function of heat-conducting and radiating.

Description

technical field [0001] The invention relates to the field of organic electroluminescence, in particular to an organic electroluminescence device with an excellent heat dissipation structure. Background technique [0002] Organic light-emitting diodes (OLEDs) have great application potential due to their advantages such as self-illumination, wide viewing angle, power saving, easy manufacturing process, low cost, high response speed, and full color, and are expected to become an alternative to CRT, LCD, etc. High-profile next-generation flat-panel displays. [0003] Organic light-emitting diodes are white light-emitting elements, which will generate heat when emitting light. The heat energy accumulated between the substrate and the packaging board or between the substrate and the light-emitting layer will seriously reduce the luminous efficiency and uniformity of OLED elements. The structural design of existing devices And the heat dissipation of the packaging structure is po...

AI Technical Summary

Problems solved by technology

[0003] Organic light-emitting diodes are white light-emitting elements, which will generate heat when emitting light. The heat energy accumulated between the substrate and the packaging board or between the substrate and the light-emitting layer will seriously reduce the luminous efficiency and uniformity of OLED elements. The structural design of existing devices And the heat dissipation of the packaging structure is poor, which easily leads to a rapid rise in temperature. When the temperature rises to 60 degrees, the light-emitting organic material of the OLED element will deteriorate, resulting in a shortened life.

[0004] Chinese patent CN02284791.x discloses an organic light-emitting diode with a heat dissipation structure. A heat dissipation component is arranged on the second electrode of the device or the packaging component. The heat dissipation component is formed on the side facing away from the second electrode or the packaging component. Composed of many raised cover plates, the cover plates and protrusions are made of thermally conductive metal materials, such as copper or aluminum. The purpose of the heat dissipation protrusions is to increase the surface area of ​​heat dissipation. Although this heat dissipation structure has better heat dissipation performance, it increases the the cost of

Although this heat dissipation structure has a good heat dissipation function, it increases the thickness of the device, and the preparation process is complicated and the cost is high

[0006] U.S. Patent No. 6,265,820 discloses an organic light-emitting device with a heat sink. The heat sink includes a heat conduction layer, a cooling layer, and a heat dissipation layer. There is a metal Ga with a low melting point between the cathode and the package plate as the heat conduction layer. In addition, the package plate There is also another heat conduction layer and cooling layer on the outside, wherein the cooling layer includes circulating coolant, such as freon, air, etc., and finally a heat dissipation layer is arranged on the cooling layer, and the function of the heat dissipation layer is to dissipate the heat energy in the OLED Distributed into the environment, and can be designed to have a structure similar to the absorption groove. The above-mentioned structures together constitute the heat dissipation device of the OLED device. Although the device takes into account all factors that are conducive to heat dissipation, it increases the thickness and volume of the OLED device. The preparation process is also more complicated. In addition, because the metal Ga as the heat-conducting layer is directly in contact with the cathode layer, when Ga absorbs heat and is in a molten state, it will cause damage to the cathode, and it is easy to short-circuit the device.

Images