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Heat resistant film, its manufacturing method, and electrical and electronic parts

A technology of protective film and manufacturing method, which is applied in the direction of contact manufacturing, chemical instruments and methods, contact parts, etc., and can solve the problems that the layer thickness has not been studied, and the surface treatment method cannot meet the requirements, etc.

Inactive Publication Date: 2007-12-05
DOWA METALS & MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] In view of the above problems, it is obvious that general surface treatment methods cannot meet the requirements
Although the film formation and film formation methods of Sn or Sn alloy layer, Cu-Sn alloy layer, Cu layer, Ni layer and Ni alloy layer have been proposed, the most suitable combination and the most suitable layer thickness have not yet been studied

Method used

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  • Heat resistant film, its manufacturing method, and electrical and electronic parts

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] Table 1. The composition and thickness of the 16 surface treatment materials prepared in advance from No.1 to No.16 are recorded. The formation method of each layer is an electroplating method. Specifically, a Ni sulfamic acid bath was used for the Ni layer, a copper sulfate bath was used for the Cu layer, and a sulfate bath was used as the electroplating solution for the Sn layer, and pickling was performed before and after the Ni electroplating process.

[0057] No. 9, No. 10, and No. 15 were not subjected to Ni electroplating, No. 11 was not subjected to Ni and Cu electroplating, No. 12 was not subjected to Cu electroplating, and No. 16 was not subjected to Sn electroplating (marked as - in Table 1).

[0058] The base material is a copper alloy plate containing 1% Ni, 0.9% Sn, and 0.05% P. It is a rolled material with a thickness of 0.25mm. μm, the surface oxide layer thickness of the base material is about 7nm, which is much smaller than the required 20nm thickness...

Embodiment 2

[0077] It has the same composition of each electroplating layer as in Example 1. However, the base material of No.17, 18, and 21 materials is brass with a plate thickness of 0.8 mm, and the base material of No. 19, 20, and 22 materials is phosphor bronze with a plate thickness of 0.2 mm. The above base material is brass material and the base material is phosphor bronze material. The surface roughness of the ten point average roughness is 1.0, 0.9μm respectively, and the average roughness of the center line is 0.13, 0.08μm respectively. The surface oxide layer of the base material Both are about 8nm thick, much thinner than the required 20nm.

[0078] The second is to carry out continuous remelting treatment at 350-800°C for 5-20 seconds. While performing remelting treatment, a Cu-Sn diffusion layer is formed, and the above materials are prepared according to the above method. The same method as in Example 1 was used to investigate and measure the coefficient of friction of th...

Embodiment 3

[0086] The same electroplating as in Example 1 was carried out on the same material as in Example 1 to form various electroplating layers. The plating layer on the outermost surface of materials No.23, 24, and 27 was changed to a Sn alloy layer. The lower electroplating layer of No.23 and No.27 materials was changed to Ni layer. The lower electroplating layer of No. 24 material was changed to Ni alloy layer. The outermost electroplating layer of No.25, 26, and 28 materials is a Sn layer, and the lower electroplating layer is changed to a Ni alloy layer.

[0087] The Sn alloy electroplating layer uses an organic complex salt solution for Sn-10% Zn electroplating. The Ni alloy plating layer was Ni-5%P plating using a watt bath added with phosphorous acid.

[0088] The same remelting conditions as in Example 1 were selected for remelting treatment. During the Sn-Zn alloy electroplating process, Zn will diffuse to the surface to form an oxide centered on Zn oxide, but it does n...

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Abstract

The invention provides a film having excellent heat resistance, formability and solderability, and used for coating the surface of a material, its manufacturing method, and further electrical and electronic parts coated with the film. An Ni or Ni-alloy layer, a Cu layer and an Sn or Sn-alloy layer are applied to the surface of the material composed of copper alloy, etc., in order from the surface side. Then reflow treatment is applied at 300-900 deg C for 1-300s. By this method, the heat resistant film having the following layers can be obtained: an Sn or Sn-alloy layer having a thickness X of 0.05-2 mu m on the outermost surface side; an alloy layer containing an intermetallic compound composed essentially of Cu-Sn and having a thickness Y of 0.05-2 mu m on the inner side, an average smoothness of the surface smoothness of 0.2-0.7 mu m at ten and the center line average smoothness of 0.05-0.10 mu m.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 01143394.9 with the same name, and the original filing date was December 21, 2001. 【Technical field】 [0002] The present invention relates to the surface treatment of the following terminals and its manufacturing method. For example, the surface treatment and manufacturing method of multi-pole terminals such as automotive wiring harnesses that require heat resistance, low wear when plugged in or pulled out, and a small friction coefficient. For example, the surface treatment and manufacturing method of charging plugs for electric vehicles that require good plug-in performance and high current flow. Surface treatment and manufacturing method of brushes for motors that require wear resistance such as in contact with rotating bodies. For example, the surface treatment and manufacturing method of battery terminals that require wear resistance and corrosion resistance. And the surface treatment...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/01B32B33/00B32B38/18C23C30/00C23C28/02C25D5/26C25D7/00H01R13/03H01R43/16
Inventor 菅原章成枝宏人尾崎太一
Owner DOWA METALS & MINING CO LTD
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