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Epoxy-organic silicon mixed resin combination and luminous semiconductor device

A mixed resin and silicone technology, applied in semiconductor devices, organic compound/hydride/coordination complex catalysts, semiconductor/solid device components, etc., can solve the problems of easy dust adhesion, low moisture resistance and durability, and light transmission Excellent installation reliability and excellent crack resistance

Inactive Publication Date: 2007-12-19
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are disadvantages that even in such a transparent epoxy resin, the moisture resistance durability is low due to the high water absorption rate of the resin, the light durability is low because of the low light transmittance to short-wavelength light in particular, or the photoaging and pigmentation
[0005] However, such silicone-based cured products have the following disadvantages: when crack resistance is to be improved, stickiness generally remains on the surface of the cured product, dust is easy to adhere, and light transmission is impaired.
[0011] However, the cured product using a cationic curing agent lacks flexibility. When this resin is used as a sealing material for a light-emitting diode, a large stress is generated between the light-emitting element and the sealing resin during heating and cooling, and cracks in the resin are induced. Occurrence, peeling of the sealing resin from the case, cutting of the connecting wire, etc., will cause the output power of the LED to decrease or fail.
[0012] In addition, a B-staged resin composition for encapsulating an optical semiconductor composed of a silsesquioxane having at least two epoxy rings, an epoxy resin, an acid anhydride curing agent, and a curing catalyst is disclosed (see Patent Document 9 : Japanese Unexamined Publication No. 2005-263869), but there is no disclosure or hint about the selection of its curing catalyst and the possibility of coloring during the reflow test.

Method used

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  • Epoxy-organic silicon mixed resin combination and luminous semiconductor device
  • Epoxy-organic silicon mixed resin combination and luminous semiconductor device
  • Epoxy-organic silicon mixed resin combination and luminous semiconductor device

Examples

Experimental program
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Effect test

Embodiment

[0062] Examples and comparative examples are shown below to describe the present invention concretely, but the present invention is not limited by the following examples.

[0063] First, the evaluation method of the coating protection material of an Example and a comparative example is shown.

[0064] Use the resin composition as a sealing material for rod-shaped or cannonball-shaped light-emitting semiconductor devices with LED chips and lead frames with a thickness of 5mm, and cure at 100°C for 2 hours, and then at 150°C for 4 hours, and perform the following items evaluate.

[0065] surface stickiness

[0066] Observe the rod-shaped cured product by contact, and evaluate whether the surface is sticky or not.

[0067] Appearance of cured product

[0068] The presence or absence of discoloration was visually evaluated in the rod-shaped cured product and the fabricated light-emitting semiconductor device.

[0069] Reflow resistance

[0070] The produced light-emittin...

manufacture example

[0078] [Manufacturing example] Synthesis of silsesquioxane having an epoxy functional group

[0079] After adding 900 g of isopropanol, 13 g of a 25% aqueous solution of tetramethylammonium hydroxide, and 91 g of water, 255 g of γ-glycidoxypropyltrimethoxysilane (KBM403 manufactured by Shin-Etsu Chemical Co., Ltd.) was added, and stirred at room temperature for 20 Hour.

[0080] After the reaction, 1200 g of toluene was added to the system, and isopropanol and the like were removed under reduced pressure. Using a separatory funnel, wash the residue with hot water. After washing until the aqueous layer became neutral, the toluene layer was dehydrated with anhydrous sodium sulfate. Anhydrous sodium sulfate was filtered off, and toluene was removed under reduced pressure to obtain the target resin (resin 1). The epoxy equivalent weight is 185 g / mol.

[0081] In addition, as an epoxy resin (component (B)) having at least two epoxy functional groups in one molecule, "Celokide 2...

Embodiment 1～3 and comparative example 1、2

[0085] The compounding amounts shown in the following Table 1, the components (A), (B), (C) and (D) were compounded, and the cured products and light-emitting semiconductor devices were produced under the above conditions, and the surface tackiness and cured products were measured according to the above evaluation methods. Appearance, reflow resistance. The results are shown in Table 1 together.

[0086] Table 1

[0087] Composition (parts by mass)

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PUM

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Abstract

The epoxy-silicone mixed resin composition is characterized in that (A) an organopolysilsesquioxane resin having at least two epoxy functional groups or oxetane groups in one molecule, (B ) an epoxy resin having at least 2 epoxy functional groups in one molecule, (C) a curing agent and (D) a curing catalyst as essential components, and the curing catalyst contains one or more quaternary phosphonium salts. The epoxy-silicone hybrid resin composition of the present invention can provide a light-emitting semiconductor device with excellent mounting reliability since the light-emitting semiconductor element is coated and protected with its cured product, and thus has many industrial advantages. In this case, the cured product having a glass transition temperature of 130°C or higher has excellent crack resistance in the heat resistance test, especially since no dust adheres to the surface of the cured product.

Description

technical field [0001] The present invention relates to an epoxy-silicon hybrid resin composition effective as a light-emitting semiconductor coating protective material that is transparent in basic properties, maintains no surface tackiness, and has excellent transparency in a reflow test, and uses the same to coat a light-emitting semiconductor element. light-emitting semiconductor devices. Background technique [0002] As a resin composition for covering and protecting light-emitting semiconductor elements such as light-emitting diodes (LEDs), transparency is required for the cured product, and epoxy resins such as bisphenol A epoxy resins or alicyclic epoxy resins and acid anhydrides are generally used. A resin composition obtained by using a curing agent (see Patent Document 1: Japanese Patent No. 3241338, Patent Document 2: Japanese Patent Application Laid-Open No. 7-25987). [0003] However, there are disadvantages that even in such a transparent epoxy resin, the moi...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L63/00C08K5/53C09K3/10H01L33/00H01L33/56
CPCB01J31/0268C08K5/5317C08L63/00C08L83/04C08L2205/02H01L23/296
Inventor 相宫拓司儿玉欣也清水久司柏木努
Owner SHIN ETSU CHEM IND CO LTD