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Metal film and formation method of metal film

A metal film and substrate technology, applied in metal material coating process, transportation and packaging, liquid chemical plating, etc., can solve troublesome problems such as plasma surface treatment, and achieve excellent adhesion properties

Inactive Publication Date: 2008-01-09
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method requires troublesome plasma surface treatment, so it is necessary to develop a simpler method

Method used

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  • Metal film and formation method of metal film
  • Metal film and formation method of metal film
  • Metal film and formation method of metal film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0153] [Manufacturing of substrates]

[0154] The following polymerization initiating layer coating solution was applied to a polyimide film (trade name: Kapton, manufactured by Du Pont Toray Co., Ltd.) by using a #18 rod and dried at 80° C. for 2 minutes.

[0155] The resulting film was preliminarily cured by irradiation with a 400 W high-pressure mercury lamp (UVL-400 P, manufactured by Riko Kagaku Sangyo Co., Ltd.) for 10 minutes to form a polymerization initiation layer on the substrate. The obtained polymerization initiating layer had a thickness of 6.5 μm.

[0156] Rz of the polyimide film substrate was 15 nm calculated according to JIS B 0601 from the measured value in the range of 40 μm×40 μm by Nanopics 1000 (manufactured by Seiko Instruments Inc.). The same measurement was performed on the polymerization initiating layer formed on the polyimide film, and it was found that Rz was 10 nm and the surface roughness of the substrate used in the examples was within the pre...

Embodiment 2

[0176] The metal film obtained in Example 1 was further plated in a plating bath of the following composition for 15 minutes to produce a metal film 2 .

[0177]

[0178] Copper sulfate 38g;

[0179] Sulfuric acid 95g;

[0180] Hydrochloric acid 1mL;

[0181] Copper Gleam PCM (manufactured by Meltex Co., Ltd.) 3 mL; and

[0182] water 500g

[0183] (fine particle dispersion state in the polymer layer on which the metal film is formed)

[0184] In Example 2, the dispersed state of fine particles in the polymer layer on which the metal film was formed was observed. Details are as follows.

[0185] The region where the metal film was formed was cut with a diamond cutter (trade name: Sumiknife) equipped with a thin slice cutter (manufactured by Leika Co., Ltd.) by using a microscope to obtain a sample having a clean plated cross section. The obtained sample was observed by SEM to confirm the dispersion state of fine particles in the polymer adjacent to the metal film. FIG...

Embodiment 3

[0191] [Formation of cross-linked polymers]

[0192] A coating solution of the following composition was applied to the substrate used in Example 1 on which the polymerization initiating layer was formed by using a #18 rod. The obtained film had a thickness of 0.8 μm. Do the same for the back.

[0193]

[0194] Polymer A 0.25 g and cyclohexanone 8.0 g having a polymerizable group (the synthesis method is as follows)

[0195]

[0196] (Synthesis of Monomer A)

[0197] To a 500mL three-necked flask, add 58.6g of 2-hydroxyethyl methacrylate, and then add 250ml of acetone, and stir. After adding 39.2 g of pyridine and 0.1 g of p-methoxyphenol, the mixture was cooled in an ice bath containing ice water. After cooling the mixed solution to 5° C., 114.9 g of 2-bromoisobutyric acid bromide were added dropwise through the dropping funnel over 3 hours. After the dropwise addition was completed, the mixture was taken out from the ice bath, followed by stirring for 3 hours. The ...

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Abstract

The present invention provides a metal film formed by applying an electroless plating catalyst or its precursor to a polymer layer on a base plate having a surface roughness of 500 nm or less and then carrying out electroless plating, the polymer layer containing a polymer which has a functional group capable of interacting with the electroless plating catalyst or its precursor and is chemically bonded directly to the base plate, wherein the adhesion strength between the base plate and the metal film is 0.2 kN / m or more.

Description

technical field [0001] The present invention relates to a metal film and a method for forming the metal film. Background technique [0002] Metal films formed on substrates by pattern-wise etching have been used in various electronic products. Regarding the metal film formed on the substrate (metal substrate), the adhesion property between the substrate and the metal film is obtained by roughening the surface of the substrate to have an anchor effect. As a result, the substrate interface of the formed metal film becomes rough, causing a problem of deterioration of high-frequency characteristics in the case of using the metal film as an electrical wiring. In addition, when forming a metal substrate, a complicated process of treating the substrate with a strong acid such as chromic acid is required for surface roughening. [0003] To solve this problem, a method has been developed (refer to Japanese Patent Application Laid-Open (JP-A) No. 58-196238): coating a monomer-contai...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/20C23C18/28C25D5/56
CPCH05K2201/0236H05K3/387H05K1/0237C23C18/28C23C18/30Y10T428/265Y10T428/31678
Inventor 加纳丈嘉川村浩一
Owner FUJIFILM CORP