Polyamide thermosol for clothing and preparation method thereof

A polyamide hot-melt adhesive and clothing technology, applied in the direction of adhesives, etc., can solve the problems that need to be further improved and need to be improved, and achieve the effect of narrow molecular weight range, fast curing, water resistance and solvent resistance improvement.

Active Publication Date: 2008-02-20
南通天洋光伏材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Chinese patent CN1410499A invented a long carbon chain nylon hot-melt adhesive, but its washing resistance, especially the performance after hot water washing, needs to be improved. U.S. patent US5424371A, German patent 19512004, etc. have also proposed to improve polyamide hot-melt adhesive Heat-resistant and flexible approach that makes it better for bonding metal, plastic films
[0006] It can be seen that the specificity of polyamide hot melt adhesive is very strong. As a hot melt adhesive for clothing, its washing resistance and dry cleaning resistance need to be further improved.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] In the autoclave with stirrer, inlet pipe, exhaust pipe, temperature and pressure testing device, add dimerized tall oleic acid (56.2g), azelaic acid (37.6g), sebacic acid (80.8g ), stearic acid (8.52g), hexamethylenediamine (5.8g), nonanediamine (7.9g), decanediamine (17.2g), dodecyldiamine (20g), caprolactam (33.9g), Laurolactam (59.1g), ω-aminoundecylidene acid (27.4g), 1-phenyl-3-pyrazolidinone (1.42g), water (5.0ml), replaced with nitrogen and evacuated as much as possible Remove the air in the kettle, then add nitrogen again to make the internal pressure reach 0.5Mpa, raise the temperature to 195°C, and control the pressure to 1.0Mpa, keep the temperature for 2.5 hours, cool down to 160°C, depressurize to 0.08Mpa for dehydration, and remove small After the molecule was added, N-diethylaminopropyl octadecylamide (1.1g) and the condensation product (0.8g) of nonylphenol, formaldehyde and tetraethylenepentamine were added, and the material was discharged after stirri...

Embodiment 2

[0031] In the autoclave with stirrer, inlet pipe, exhaust pipe, temperature and pressure test device, add dimer soybean oil fatty acid (81.5g), adipic acid (29.2g), sebacic acid (70.8g) successively , dodecyl diacid (23g), benzoic acid (6.1g), hexamethylenediamine (3.5g), octanediamine (7.2g), decanediamine (37.9g), dodecyldiamine (10g ), caprolactam (22.6g), laurolactam (59.1g), ω-aminoundecalactic acid (27.4g), 1-phenyl-3-pyrazolidinone (1.2g), water (8.0ml), Replace with nitrogen and evacuate, remove the air in the kettle as much as possible, then add nitrogen again to make the internal pressure reach 0.6Mpa, raise the temperature to 200°C, and control the pressure to 1.4Mpa, keep the reaction for 2.0 hours, cool down to 170°C, and decompress To 0.097Mpa dehydration, and after removing small molecules, add N-diethylaminopropyl octadecyl amide (0.9g) and the condensate (0.8g) of nonylphenol, formaldehyde and tetraethylenepentamine, stir After reacting for 0.5 hour, the mate...

Embodiment 3

[0034] In the autoclave with agitator, inlet pipe, exhaust pipe, temperature and pressure testing device, add dimer tall oleic acid (112g), propionic acid (1.8g), nylon 66 salt (48.8g) successively, Nylon 1010 salt (71.2g), nylon 1212 salt (41.2g) caprolactam (26g), laurolactam (9.9g), ω-amino undecylide (27.5g), water (6.0ml), replace with nitrogen and Vacuum, try to remove the air in the kettle, and then add nitrogen again to make the internal pressure reach 0.6Mpa, raise the temperature to 220°C, and control the pressure to 1.8Mpa, keep the reaction for 2.5 hours, cool down to 180°C, depressurize to 0.085Mpa for dehydration , and after removing the small molecules, add N-diethylaminopropyl octadecylamide (0.9g) and the condensation product (0.8g) of nonylphenol, formaldehyde and tetraethylenepentamine, and stir the reaction after 0.5 hours After discharging, a polyamide hot-melt adhesive with a melting point of 112-119° C. is obtained.

[0035] Using the detection method o...

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Abstract

The invention discloses a polyamide hot melt adhesive used for clothing a preparation method thereof. With the protection of nitrogen-gas, an unsaturated fatty acid dimers comprising carbon numbers between 12 and 20, an dicarboxylic acid comprising carbon numbers between 6 and 12, a molecular weight regulator, a diamine, a lactam, water and a stabilizer are subject to lower temperature and pressure and dehydration in reactions, next, an N-diethylamine- propyl-Octadecanamide, a nonyl phenol, condensation products of formaldehyde and tetraethylenepentamine are added in and stirred. After the series of reactions, the polyamide hot melt adhesive is obtained. The polyamide hot melt adhesive of the invention of used for clothing has the advantages of narrow molecular weight range, rapid solidification and excellent performance of water resistance and solvent resistance, etc.; the copolyamide is modified by adding appropriate proportions of condensation products of N-diethylamine propyl-Octadecanamide and mnnnich amide, so as to improve the water resistance and solvent resistance substantially. The loss rate of peeling strength of the products obtained is less than 20 percent after alkaline cleaning above 60 DEG C; the loss rate of peeling strength of the products obtained is less than 10 percent after dry cleaning by tetrachloroethylene.

Description

technical field [0001] The invention relates to a hot-melt adhesive and a preparation method thereof, in particular to a polyamide hot-melt adhesive and a preparation method thereof. technical background [0002] Polyamide hot-melt adhesive has outstanding advantages such as narrow melting range and fast curing speed, so that this type of adhesive can be quickly solidified after heating, melting and coating, and it can be cured quickly after a little cooling, and it still maintains good bonding strength near the softening point. Since the hot melt adhesive contains polar groups such as amide groups, amino groups, and carboxyl groups, it has good adhesion to many polar materials. Therefore, polyamide hot-melt adhesives are widely used in many industries such as chemical industry, automobile, light industry, food, textile, etc., and a number of patents have been proposed at home and abroad, aiming to strengthen its characteristics in a certain aspect: [0003] U.S. Patent US3...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/08
Inventor 李哲龙朱万育曾作祥陶思玉马志艳
Owner 南通天洋光伏材料科技有限公司
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