Silicon chip etching method
A silicon wafer and etching technology, which is used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of rough surface of the sidewall of the etching groove, difficult to guarantee the characteristic structure of etching, and ineffectiveness of the sidewall of the etching groove. Ground protection and other issues, to achieve the effect of smooth sidewalls, smooth edges, and obvious structural features
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[0029] The present invention is mainly used to etch silicon wafers, and its preferred specific implementation is to include three steps of preliminary etching, main etching, and over-etching. The purpose of the preliminary etching step is to remove the hard mask above the silicon wafer layer. For the film layer or other dielectric layers, the main etching step realizes the etching of the silicon wafer, and the purpose of the over-etching step is to further etch the silicon wafer layer to achieve a complete etching of the silicon wafer layer.
[0030] The following takes the etching of polysilicon as an example to specifically describe the implementation process of the present invention:
[0031] Polysilicon is an important area in the multilayer structure of integrated circuits, and its patterned etching quality will have a direct impact on the subsequent process flow.
[0032] As shown in Figure 1, MOSFET (metal-oxide semiconductor field effect transistor) is a representative ins...
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