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Nano tin soldering method by using atomic force microscopy probe as welding gun

Atomic force microscopy, atomic force microscopy technology, applied in nanotechnology, nanotechnology, nanostructure manufacturing and other directions, can solve the problems affecting the overall performance of the device, the large difference in redox potential, etc., which is conducive to industrialization, accurate positioning, Universal effect

Inactive Publication Date: 2008-07-23
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method can only be applied to oxidizable substrate materials and systems in which the redox potentials of the substrate and the nanomaterials to be welded differ greatly. will inevitably affect the overall performance of the device

Method used

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  • Nano tin soldering method by using atomic force microscopy probe as welding gun

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Example 1: Using ZnO sol as solder, implement nano-welding on a silicon wafer to obtain a 2×2 array

[0025] (1) Preparation of solder: with Zn(OAc) 2 2H 2 O as a precursor of ZnO. Zn(OAc) 2 2H 2 O was dissolved in isopropanol, and a small amount of twice distilled water was added dropwise under the action of the stabilizer diethanolamine. After fully stirring and hydrolyzing, a transparent ZnO sol was obtained, and the solubility of the sol was 0.5mol / L.

[0026] (2) Nano-solder dipping: Use a pipette gun to take 10 μL of the above-mentioned zinc oxide sol, drop it on the newly cleaved mica sheet, dip the AFM probe into the solder, and let the tip stand for 5 minutes.

[0027] (3) Welding implementation: using contact mode imaging technology, select a certain area on the pre-treated silicon wafer for imaging, and record the image. Reduce the scanning range to 50nm, and then apply a certain bias voltage on the probe to make the tip touch the surface, keep the scann...

Embodiment 2

[0030] Embodiment 2 uses ZnO sol as the soldering tin to the welding of zinc oxide nanowires

[0031] The preparation of the solder and the solder dipping of the AFM probe are basically the same as in Example 1. Before implementing soldering, it is first necessary to detect whether the zinc oxide nanowires spin-coated on the silicon wafer are single dispersed. Select a zinc oxide nanowire as the target we want to weld, and get its height image. After the AFM probe is dipped in solder, after standing for 20 minutes, the AFM scans to find the zinc oxide nanowires to be welded, and records the height image. The implementation of the welding process still adopts the contact mode, and the specific operation process is as described in step (3) of embodiment 1. Figure 3 is an AFM picture of a single ZnO nanowire welded by an AFM probe. It can be seen from the figure that the positioning of the soldering point is accurate, and the amount of soldering tin is well controlled.

Embodiment 3

[0032] Embodiment 3 uses silver ammonia solution as solder, adopts AFM probe non-contact mode to implement nano welding

[0033] Based on the traditional silver mirror reaction as the theoretical basis, the introduction of gas phase reaction in technical implementation simplifies the actual operation.

[0034] The specific implementation process is as follows:

[0035] (1) Preparation of solder: add 2% NH 4 OH aqueous solution was added dropwise to 2% AgNO 3In the solution, silver ammonia solution is obtained, and the pH is adjusted to 10 with NaOH, which is used as solder for nano-welding. The silicon wafer is used as the substrate, and the monodisperse single-walled carbon nanotubes placed on the silicon wafer are used as the welding object, and the AFM tapping mode imaging is used to image the carbon nanotubes to be welded.

[0036] (2) Nano-solder dipping: Select the NSC11 tip as the welding torch, dip an appropriate amount of solder (silver-ammonia solution), let it st...

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Abstract

The invention relates to a nanometer tin soldering method which belongs to the technical field of nanometer and adopts an atomic force microprobe as a welding torch, specifically speaking: the atomic force microprobe, soldering tin material and welding mode are selected; an atomic force microscope is adopted to find a nanometer component to be welded, namely, to precisely position a welding point; soldering tin is dipped on a probe and then atomic force imaging scanning is carried out to find the original position which is the nanometer device selected in the second step, the height image is recorded and the scanning scope is shortened to lock the welding position on the nanometer component, then a bias voltage is applied on the probe of the atomic force microscope so that the probe can touch the surface of the nanometer component, then the scanning operation is kept and weld is carried out, then the bias voltage is removed and the normal atomic force microscope imaging state is returned after the welding operation is finished, the welding effect is inspected and the welding result is recorded; the nanometer welding operation on more than one places on the nanometer component is repeated and the welding result is recorded. The invention is a nanometer 'tin soldering technology' that is applied to the nanometer component and is precise in positioning, controllable in welding size, high in automation degree and strong in universality.

Description

technical field [0001] The invention relates to a welding method in the field of nanotechnology, in particular to a nano-soldering method based on an atomic force microprobe as a welding torch. Background technique [0002] In recent years, the preparation and deviceization of nanomaterials has always attracted the interest of researchers in different fields, especially the development of nanodevices has attracted widespread attention, and has gradually become the main field of nanotechnology research. So far, people have developed a variety of methods to synthesize nano-components with different compositions and controllable shapes and sizes, such as nanospheres, nanopolyhedra, nanowires and nanorods, nanotubes, and nanosheets. Through the functionalization of the surface of the nano-components and the substrate material, the nano-components are successfully assembled into various patterns at specific positions on the substrate surface. However, the current "bottom-up" nan...

Claims

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Application Information

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IPC IPC(8): B82B3/00B23K1/00G12B21/20G12B21/08
Inventor 郭守武张益沈广霞黄世斌张华
Owner SHANGHAI JIAO TONG UNIV
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