Method for preparing GaAs micro/nono optical element

A technology of optical elements and optical arrays, applied in optical elements, optics, microstructure technology, etc., can solve the problems of expensive and difficult, high processing costs, no low-cost micro/nano optical element processing methods, etc., and achieve high replication accuracy , The effect of low processing cost

Inactive Publication Date: 2008-08-06
XIAMEN UNIV
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AI Technical Summary

Problems solved by technology

The advantage of the optical processing method is that it can process any irregular surface lens (especially the binary optical element) and can be replicated on a large scale. The main disadvantage is that the processing steps are complicated and the processing cost is high, especially for some important Optical materials, such as quartz and GaAs, still have great difficulties in processing complex three-dimensional structures with continuous smoothness
The advantage of binary optical technology is that it cleverly overcomes the difficulties encountered in processing a continuous phase shape, and creates a novel and very important direction for the preparation of high-efficiency diffractive micro/nano optical elements, and can be used on a variety of materials processing; its main disadvantage is that this method needs multiple steps such as glue re

Method used

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  • Method for preparing GaAs micro/nono optical element
  • Method for preparing GaAs micro/nono optical element
  • Method for preparing GaAs micro/nono optical element

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0035] Example 1

[0036] figure 1 A schematic diagram of the processing technology of Example 1 of the present invention is given.

[0037] figure 1 a is the hot embossing process, the polymer material is PMMA 2 (polymethyl methacrylate) and the quartz optical element master 1 is placed in the hot embossing device, the selected glass transition temperature (T g ) temperature is 100°C. PMMA 2 has a thickness of 1mm and an area of ​​2cm 2 ,use figure 2 The shown hot embossing device is heated up to the glass transition temperature (T g ) above (generally controlled at 135°C), and then apply a pressure of 4 to 10 MPa for replication.

[0038] figure 1 B is the demoulding and separation process after hot pressing replication. After the hot pressed PMMA sheet 2 is separated from the quartz optical element master plate 1, the PMMA sheet 2 also needs to be degreased. 3 PO 4 50g / L+Na 2 CO 3 25g / L+NaOH 20g / L for degreasing treatment, the deoiling temperature is 85°C, and...

Example Embodiment

[0046] Example 2-6

[0047] The specific operation steps of Examples 2-6 are the same as those of Example 1, and the specific composition of the solution is shown in Table 1, wherein the etching effect "+" is good.

[0048] Table 1

[0049] Example

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Abstract

The invention relates to a method for preparing a micron/nanometer optical element on GaAs and a micron/nanometer optical element thereof, in particular to a preparation method in which the micron/nanometer optical array element is directly etched on the surface of semiconductor GaAs material at one time with low cost, simple method and no complex processes such as mask lithography and so on. The quartz with the micron/nanometer optical array element is taken as an original mother blank; a relief structure on the quartz micron/nanometer optical array element is accurately replicated on the surface of polymer material and then a Ti layer and a Pt layer are sputtered in sequence; the surface is then metallized to obtain a template electrode. The template electrode is used as a working electrode and is adjusted to be parallel to a processed workpiece GaAs; an electrochemical etching solution is added into an electrolytic cell and an etching agent is generated on the template electrode; a restraint agent in the etching solution is used for compressing the thickness of an etching agent layer to the thickness of a micron or a nanometer level; GaAs sheets are controlled to move to the surface of the template electrode until the structure on the template electrode is completely replicated on the surface of the processed workpiece and the separation of the GaAs sheets and the template electrode is controlled.

Description

technical field [0001] The invention relates to a micro / nano optical element, in particular to a processing tool for polymer material / Ti / Pt prepared by using hot embossing technology combined with magnetron sputtering coating technology, and then using electrochemical confinement etching processing technology in semiconductor A processing method and device for processing micro / nano optical array element structure by etching the surface of GaAs material. Background technique [0002] Micro / nano optical elements refer to free optical curved surfaces and microstructured optical elements whose surface shape accuracy can reach submicron level and surface roughness can reach nanometer level. Due to its advantages of small size, light weight, flexible design, easy arraying and batch replication, it can complete new functions that traditional optical components cannot achieve, and can form many new optical systems (Zhou Haixian, Wang Yongnian, etc. Transl. Micro-optical components,...

Claims

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Application Information

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IPC IPC(8): B81C1/00C25F3/02G02B3/00
Inventor 汤儆张力马信洲田昭武
Owner XIAMEN UNIV
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