166 results about "Optical arrays" patented technology

The present invention provides an optical array module that includes a plurality of semiconductor devices mounted on a thermal substrate formed with a plurality of openings that function as micro-reflectors, wherein each micro-reflector includes a layer of reflective material to reflect light. Such material preferably is conductive so as to provide electrical connection for its associated semiconductor device.

An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.

A lighting module has an array of light emitting elements arranged on a substrate in an x-y grid, and a reflector plate arranged on the substrate, the reflector plate having an array of openings arranged on an x-y grid such that the openings correspond to the light emitting elements, the dimensions of the reflector plate and the openings arranged to partially collimate light from the light emitting elements. A method of manufacturing a lighting module includes arranging an array of light emitting elements on a substrate, manufacturing a reflector plate having an array of openings, the openings located so as to correspond to the light emitting elements and created so as to only partially collimate light from the light emitting elements, and attaching the reflector plate to the substrate such that each opening in the reflector plate is centered on a light emitting element.

The invention divides the lens focusing process into two or more surfaces that incorporate multiple curved axial optic elements on each surface. The axial optics may be manufactured by molding, machining, or by suspended film. If suspended film is used, then both sides of an optic may have a suspended film that is transparent. Alternatively, one side of the suspended film optic may use a reflective film.

Apparatuses and methods determine positional information from a reflected optical signal for an object on a per pixel basis. A spread spectrum imaging system includes a transmitting module transmitting a transmitted optical signal that illuminates a target space and contains a transmitted pulse that is modulated with a first pseudo-noise (PN) code. The imaging system includes a receiving module that receives a reflected optical signal from an object. The reflected signal is processed by an optical array that detects a detected signal from the reflected optical signal, where the detected signal contains a plurality of pixels spanning a target space. When the determined PN code corresponds to the selected PN code, image information and the positional information is presented for the object. When different positional information is obtained for different pixels in the image, the imaging system may determine that different objects appear in the received image.

Roughly described, a submount has a standoff structure protruding from its surface. An optical component is pressed against the standoff structure until tilt and planar non-uniformities are removed, and then bonded to the submount using an adhesive placed in the wells between the protrusions of the standoff structure. The standoff structure preferably has a total surface area contacting the optical component which is much smaller than the area by which the optical components overlap the submount. The optical component mounted in this manner can be an optical array component (including an optical fiber array), or a component having only a single optical port. A second optical component can be attached to the submount in the same manner, greatly simplifying the vertical alignment problems between the two components.

Gradient index (GRIN) lens chips and associated small form factor optical arrays for optical connections, and related fiber optic connectors are disclosed. By aligning GRIN lenses within a GRIN lens chip, a more precise and reliable alignment may be achieved with respect to optical fibers than if a single conventional ferrule is utilized to align and secure both GRIN lenses and optical fibers. The GRIN lens chip may include a GRIN lens received and thereby aligned within a groove disposed between a fiber end and a terminal end of a GRIN lens holder body. The optical fibers may also be received and thereby aligned within a groove of a ferrule body. In this manner, when the GRIN lens chip containing the GRIN lenses is aligned with a ferrule body containing the optical fibers, then the GRIN lenses may be precisely located relative to the optical fibers.