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Vanadium-silver low melting glass and conductive slurry containing the glass

A low-melting glass, electronic paste technology, applied in the field of conductive electronic paste, can solve the problems of inability to chemically react adverse effects, and achieve the effects of good hardness and chemical stability, low sintering temperature, and overcoming damage

Inactive Publication Date: 2010-05-26
BEIJING INSTITUTE OF GRAPHIC COMMUNICATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, another requirement for the bonding phase of the electronic paste is that the various components in the low-melting glass cannot chemically react with the functional powder of other components in the electronic paste or have adverse effects during application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The various raw materials in the glass composition use the corresponding industrial grade oxide or carbonate powder, and the glass composition is: V 2 o 5 75%, Ag 2 O 8%, B 2 o 3 7%, ZnO 2%, Bi 2 o 3 5%, BaO 3%. Grind commercially available industrial grade vanadium pentoxide, silver oxide, boron trioxide, zinc oxide, bismuth oxide and barium carbonate, measure them accurately according to the formula, and mix them evenly. Melt in an alumina crucible at 750°C for 30 minutes, and then pour and press the molten glass into thin sheets. After the glass flakes are ground, pass through a 100-mesh sieve, and then be ground to an ultrafine powder with an average particle size of 3 μm by airflow for use.

[0033] The glass transition temperature of the glass obtained by differential thermal analysis was 201°C.

[0034]Low-melting glass is used to make silver conductive pastes. Silver conductive paste consists of ultra-fine flake and spherical silver powder, organic c...

Embodiment 2

[0037] The various raw materials in the glass composition use the corresponding industrial grade oxide or carbonate powder, and the glass composition is: V 2 o 5 60%, Ag 2 O 5%, P 2 o 5 10%, SiO 2 1%, B 2 o 3 5%, Bi 2 o 3 5%, Sb 2 o 3 2%, Al 2 o 3 1%, SnO 2 3%, BaO5%, CaO2%, Na 2 O 1%. Commercially available industrial grade vanadium pentoxide, silver oxide, ammonium dihydrogen phosphate, silicon oxide, boron trioxide, antimony oxide, bismuth oxide, aluminum oxide, tin oxide, barium carbonate, calcium carbonate and sodium carbonate , after accurate measurement according to the formula, mix well. In an alumina crucible, it is first kept at 250°C for 60 minutes to fully decompose ammonium dihydrogen phosphate, and then it is kept at 850°C for 50 minutes to melt, and then the molten glass is poured and pressed into thin sheets. After the glass flakes are ground, pass through a 100-mesh sieve, and then be ground to an ultrafine powder with an average partic...

Embodiment 3

[0042] The various raw materials in the glass composition use the corresponding industrial grade oxide or carbonate powder, and the glass composition is: V 2 o 5 50%, Ag 2 O10%, P 2 o 5 8%, SiO 2 2%, ZnO 5%, Bi 2 o 3 10%, Al 2 o 3 1%, SnO 2 3%, BaO 5%, MgO 2%, Na 2 O 2%, K 2 O 2%. After grinding commercially available industrial grade vanadium pentoxide, silver oxide, diammonium hydrogen phosphate, silicon oxide, zinc oxide, bismuth oxide, aluminum oxide, stannous oxide, barium carbonate, magnesium carbonate, potassium carbonate and sodium carbonate, After accurately measuring according to the recipe, mix well. In an alumina crucible, it is first kept at 250°C for 60 minutes to fully decompose the diammonium hydrogen phosphate, then it is kept at 900°C for 60 minutes to melt, and then the molten glass is poured and pressed into thin sheets. After the glass flakes are ground, pass through a 100-mesh sieve, and then be ground to an ultrafine powder with an ave...

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Abstract

The invention relates to a vanadium-silver low-melting point glass for composing conducting electronic paste and a conducting electronic paste containing the same. A viscous paste composition is obtained by dispersing a compound powder mixed with low-melting point glass and functional powder in an organic solution for producing conducting parts in various electronic components. The low-melting point glass is molten during high-temperature sintering process to take cementation effect. When electronic components are produced, the sintering temperature is 300-500 DEG C. The low-melting point glass comprises (wt %) V2O5 10-80, Ag2O 2-20, P2O5 0-30, SiO2 0-5, B2O3 0-5, ZnO 0-10, Bi2O3 0-20, Sb2O3 0-8, Al2O3 0-4, SnO2 0-10, BaO 0-20, MgO+CaO 0-5, and Li2O+Na2O+K2O 0-5. After adding the inventivelow-melting point glass, the glass has a transition temperature reduced to 200 DEG C, and has good chemical stability and mechanical strength.

Description

technical field [0001] The invention relates to a vanadium-silver low-melting glass and conductive electronic paste containing the low-melting glass. It is mainly used to make conductive parts in various electronic components. It is composed of three parts: conductive functional powder, organic carrier and low-melting glass that acts as a bond during high-temperature sintering. The low-melting glass melts and softens when the electronic paste is sintered to act as a bond. Background technique [0002] Most of the low-melting glasses currently used as the binder phase in electronic pastes are lead borate and lead silicate glasses. Due to the harm of lead to the environment and human body, various electronic components are required to be lead-free. Therefore, it is of great significance to seek lead-free low-melting glass to replace the current lead-containing glass. [0003] In addition, on the premise of ensuring the performance of the electronic components, the sintering ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C4/14C03C3/062C03C3/21
Inventor 罗世永许文才
Owner BEIJING INSTITUTE OF GRAPHIC COMMUNICATION