Method for preparing negative photosensitive polyimide based on 2,2-di[4-(2,4-diaminophenyloxy)phenyl]hexafluoropropane

A technology of diaminophenoxy and photosensitive polyimide, which is applied in the direction of photomechanical equipment, pattern surface photolithography, optics, etc., can solve large volume shrinkage, and the preparation method has not been disclosed in literature or patent reports , restricted applications, etc.

Inactive Publication Date: 2008-09-17
DONGHUA UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this process greatly simplifies the process, reduces three wastes, and improves efficiency, it requires high-temperature imidization treatment, which limits its application in heat-sensitive components. In addition, when polyamic acid is converted into polyimide A large volume shrinkage occurs during the process, which limits its use i

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  • Method for preparing negative photosensitive polyimide based on 2,2-di[4-(2,4-diaminophenyloxy)phenyl]hexafluoropropane
  • Method for preparing negative photosensitive polyimide based on 2,2-di[4-(2,4-diaminophenyloxy)phenyl]hexafluoropropane
  • Method for preparing negative photosensitive polyimide based on 2,2-di[4-(2,4-diaminophenyloxy)phenyl]hexafluoropropane

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Dissolve 5.48 g (0.01 mol) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane in 70 mL of N-methyl-2-pyrrolidone (NMP) at room temperature solvent, a homogeneous solution was obtained. Dissolve 13.32 g (0.03 mol) of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride in 3000 ml of N-methyl-2-pyrrolidone (NMP) solvent at room temperature to obtain a homogeneous solution, and added dropwise to the NMP solution of the above-mentioned 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane, stirred and reacted at room temperature for 3 hours, and obtained Hyperbranched fluorine-containing polyamic acid solution with molecular chain end groups;

[0046] Add 2.73 grams (0.025 moles) of m-hydroxyaniline, and stir and react at room temperature for 3 hours to obtain a hyperbranched fluorine-containing polyamic acid solution terminated with phenolic hydroxyl groups;

[0047] Add 20.40 grams of acetic anhydride (0.20 moles) and 2.02 grams (0.02 moles) of triethylamin...

Embodiment 2

[0050] At room temperature, 5.48 g (0.01 mol) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane was dissolved in 1000 ml of N,N-dimethylacetamide (DMAc ) solvent to obtain a homogeneous solution. At room temperature, 2.18 grams (0.01 mole) of pyromellitic dianhydride, 4.78 grams (0.01 mole) of 4,4'-bis(3,4-dicarboxyphenoxy) biphenyl dianhydride, 6.28 grams (0.01 mole) 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]hexafluoropropane dianhydride was dissolved in 210 ml of N-methyl-2-pyrrolidone (NMP) solvent to obtain a homogeneous solution, And added dropwise to the NMP solution of the above-mentioned 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane, stirred and reacted at room temperature for 3 hours, and obtained the acid anhydride group as the macromolecular chain Terminal hyperbranched fluorine-containing polyamic acid solution;

[0051] Add 1.64 grams (0.015 moles) of p-hydroxyaniline, stir and react at room temperature for 3 hours, to obtain a hyperbranched fluori...

Embodiment 3

[0055] Dissolve 5.48 g (0.01 mol) of 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane in 100 mL of N-methyl-2-pyrrolidone (NMP) at room temperature and 200 ml of N,N-dimethylformamide (DMF) solvent to obtain a homogeneous solution. At room temperature, 2.94 grams (0.01 moles) of 3,3',4,4'-tetracarboxylic biphenyl dianhydride, 3.10 grams (0.01 moles) of 3,3',4,4'-tetracarboxylic diphenyl ether dianhydride, 5.20 grams (0.01 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride were dissolved in 1000 milliliters of N-methyl-2-pyrrolidone, 300 milliliters of N,N- In the mixed solvent of dimethylformamide and 800 milliliters N,N-dimethylacetamide (DMAc), obtain homogeneous solution, and dropwise add above-mentioned 2,2-bis[4-(2,4-diaminobenzene Oxygen) phenyl] in the solution of hexafluoropropane, stirred and reacted at room temperature for 3 hours to obtain a hyperbranched fluorine-containing polyamic acid solution with an acid anhydride group as a macromolec...

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Abstract

The invention discloses a method for preparing negative photosensitive polyimide which is based on 2, 2-bis<4-(2, 4-diaminophenoxy) phenyl> hexafluoropropane. The method takes the 2,2-bis<4-(2,4-diaminophenoxy)phenyl> hexafluoropropane and dihydric acid anhydride as raw materials for carrying out the polymerization reaction, hyper-branched fluoride-containing polyamic acid which takes the macromolecular chain end group as the anhydride group is obtained, the hyper-branched fluoride-containing polyamic acid is further reacted with p-hydroxyaniline or m-hydroxyaniline, hyper-branched fluoride-containing polyimide which takes phenolic hydroxyl as the end group by chemical imidization reaction is obtained, phenolic hydroxyl end-blocked fluoride-containing hyper-branched polyimide powder is obtained by precipitation, washing and vacuum drying process, and the hyper-branched fluoride-containing polyimide photosensitive material with the negative photosensitive performance is obtained by undergoing the functionalization after the dissolution. The material has high photosensitive performance, high resolution and excellent process, and the cured product has low water absorption, excellent heat resistance, dielectric performance and mechanical performance, thus having great application prospect in the field of electronic micro-electronics.

Description

technical field [0001] The invention belongs to a preparation method in the field of functional polymer materials, in particular to a negative photosensitive polyimide based on 2,2-bis[4-(2,4-diaminophenoxy)phenyl]hexafluoropropane Preparation. Background technique [0002] Polyimide has excellent high and low temperature resistance, chemical stability, dielectric properties and mechanical properties. It is one of the polymer materials with excellent comprehensive properties. The high-tech field has extremely important application value. [0003] Polyimide materials can not only be used in the matrix resin of carbon fiber reinforced advanced composite materials in aerospace, self-lubricating engineering plastics resistant to high and low temperature, high-performance fiber materials, motor transformers and high-performance electrical insulation materials, glass fiber reinforced printed circuits The matrix resin of the board, the high-low temperature resistant high-performa...

Claims

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Application Information

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IPC IPC(8): C08G73/10G03F7/038
Inventor 虞鑫海陈梅芳
Owner DONGHUA UNIV
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